PIC12C5XX 8-Pin, 8-Bit CMOS Microcontroller Devices included in this Data Sheet: * PIC12C508 * PIC12C509 Note: - EXTRC: External low-cost RC oscillator - XT: Standard crystal/resonator - LP: Power saving, low frequency crystal * PIC12C508A * PIC12C509A Throughout this data sheet PIC12C508(A) refers to the PIC12C508 and PIC12C508A. PIC12C509(A) refers to the PIC12C509 and PIC12C509A. PIC12C5XX refers to the PIC12C508, PIC12C508A, PIC12C509 and PIC12C509A. High-Performance RISC CPU: * Only 33 single word instructions to learn * All instructions are single cycle (1 s) except for program branches which are two-cycle * Operating speed: DC - 4 MHz clock input DC - 1 s instruction cycle Device EPROM RAM * Low power, high speed CMOS EPROM technology * Fully static design * Wide operating voltage range * Wide temperature range: - Commercial: 0C to +70C - Industrial: -40C to +85C - Extended: -40C to +125C * Low power consumption - < 2 mA @ 5V, 4 MHz - 15 A typical @ 3V, 32 KHz - < 1 A typical standby current Pin Diagram PDIP, SOIC, Windowed Ceramic Side Brazed VDD GP5/OSC1/CLKIN GP4/OSC2 GP3/MCLR/VPP 1 2 3 4 PIC12C508(A) PIC12C509(A) PIC12C508 512 x 12 25 PIC12C508A 512 x 12 25 PIC12C509 1024 x 12 41 PIC12C509A 1024 x 12 41 * 12-bit wide instructions * 8-bit wide data path * Seven special function hardware registers * Two-level deep hardware stack * Direct, indirect and relative addressing modes for data and instructions * Internal 4 MHz RC oscillator with programmable calibration * In-circuit serial programming CMOS Technology: 8 7 6 5 VSS GP0 GP1 GP2/T0CKI Peripheral Features: * 8-bit real time clock/counter (TMR0) with 8-bit programmable prescaler * Power-On Reset (POR) * Device Reset Timer (DRT) * Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation * Programmable code-protection * Power saving SLEEP mode * Wake-up from SLEEP on pin change * Internal weak pull-ups on I/O pins * Internal pull-up on MCLR pin * Selectable oscillator options: - INTRC: Internal 4 MHz RC oscillator 1998 Microchip Technology Inc. DS40139D-page 1 PIC12C5XX Device Differences Device Voltage Range Oscillator Oscillator Calibration2 (Bits) Process Technology (Microns) PIC12C508A 3.0-5.5 See Note 1 6 0.7 PIC12LC508A 2.5-5.5 See Note 1 6 0.7 PIC12C508 2.5-5.5 See Note 1 4 0.9 PIC12C509A 3.0-5.5 See Note 1 6 0.7 PIC12LC509A 2.5-5.5 See Note 1 6 0.7 PIC12C509 2.5-5.5 See Note 1 4 0.9 Note 1: If you change from the PIC12C50X to the PIC12C50XA, please verify oscillator characteristics in your application. Note 2: See Section 7.2.5 for OSCCAL implementation differences. DS40139D-page 2 1998 Microchip Technology Inc. PIC12C5XX TABLE OF CONTENTS 1.0 General Description......................................................................................................................................................................4 2.0 PIC12C5XX Device Varieties .......................................................................................................................................................7 3.0 Architectural Overview .................................................................................................................................................................9 4.0 Memory Organization ................................................................................................................................................................ 13 5.0 I/O Port ...................................................................................................................................................................................... 21 6.0 Timer0 Module and TMR0 Register .......................................................................................................................................... 23 7.0 Special Features of the CPU..................................................................................................................................................... 27 8.0 Instruction Set Summary ........................................................................................................................................................... 39 9.0 Development Support................................................................................................................................................................ 51 10.0 Electrical Characteristics - PIC12C508/PIC12C509/PIC12LC508/PIC12LC509 ...................................................................... 57 11.0 DC and AC Characteristics - PIC12C508/PIC12C509/PIC12LC508/PIC12LC509................................................................... 73 12.0 Electrical Characteristics - PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A............................................................. 77 13.0 DC and AC Characteristics - PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A ......................................................... 91 14.0 Packaging Information............................................................................................................................................................... 95 INDEX ................................................................................................................................................................................................ 101 PIC12C5XX Product Identification System ........................................................................................................................................ 105 To Our Valued Customers Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please check our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number. e.g., DS30000A is version A of document DS30000. Errata An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended workarounds. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) * The Microchip Corporate Literature Center; U.S. FAX: (602) 786-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Corrections to this Data Sheet We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure that this document is correct. However, we realize that we may have missed a few things. If you find any information that is missing or appears in error, please: * Fill out and mail in the reader response form in the back of this data sheet. * E-mail us at webmaster@microchip.com. We appreciate your assistance in making this a better document. 1998 Microchip Technology Inc. DS40139D-page 3 PIC12C5XX 1.0 GENERAL DESCRIPTION The PIC12C5XX from Microchip Technology is a family of low-cost, high performance, 8-bit, fully static, EPROM/ROM-based CMOS microcontrollers. It employs a RISC architecture with only 33 single word/ single cycle instructions. All instructions are single cycle (1 s) except for program branches which take two cycles. The PIC12C5XX delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide instructions are highly symmetrical resulting in 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time significantly. The PIC12C5XX products are equipped with special features that reduce system cost and power requirements. The Power-On Reset (POR) and Device Reset Timer (DRT) eliminate the need for external reset circuitry. There are four oscillator configurations to choose from, including INTRC internal oscillator mode and the power-saving LP (Low Power) oscillator mode. Power saving SLEEP mode, Watchdog Timer and code protection features also improve system cost, power and reliability. 1.1 Applications The PIC12C5XX series fits perfectly in applications ranging from personal care appliances and security systems to low-power remote transmitters/receivers. The EPROM technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make this microcontroller series perfect for applications with space limitations. Low-cost, low-power, high performance, ease of use and I/O flexibility make the PIC12C5XX series very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, replacement of "glue" logic and PLD's in larger systems, coprocessor applications). The PIC12C5XX are available in the cost-effective One-Time-Programmable (OTP) versions which are suitable for production in any volume. The customer can take full advantage of Microchip's price leadership in OTP microcontrollers while benefiting from the OTP's flexibility. The PIC12C5XX products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a `C' compiler, fuzzy logic support tools, a low-cost development programmer, and a full featured programmer. All the tools are supported on IBM PC and compatible machines. DS40139D-page 4 1998 Microchip Technology Inc. PIC12C5XX TABLE 1-1: Clock Memory Peripherals Features PIC12CXXX & PIC12CEXXX FAMILY OF DEVICES PIC12C508(A) PIC12C509(A) PIC12CE518 PIC12CE519 PIC12C671 PIC12C672 PIC12CE673 PIC12CE674 Maximum Frequency of Operation (MHz) 4 4 4 4 10 10 10 10 EPROM Program Memory 512 x 12 1024 x 12 512 x 12 1024 x 12 1024 x 14 2048 x 14 1024 x 14 2048 x 14 RAM Data Memory (bytes) 25 41 25 41 128 128 128 128 EEPROM -- Data Memory (bytes) -- 16 16 -- -- 16 16 Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 TMR0 A/D Converter (8-bit) Channels -- -- -- -- 4 4 4 4 Wake-up from SLEEP on pin change Yes Yes Yes Yes Yes Yes Yes Yes Interrupt Sources -- -- 4 4 4 4 I/O Pins 5 5 5 5 5 5 5 5 Input Pins 1 1 1 1 1 1 1 1 Internal Pull-ups Yes Yes Yes Yes Yes Yes Yes Yes In-Circuit Yes Serial Programming Yes Yes Yes Yes Yes Yes Yes Number of Instructions 33 33 33 33 35 35 35 35 Packages 8-pin DIP, JW, SOIC 8-pin DIP, JW, SOIC 8-pin DIP, JW, SOIC 8-pin DIP, JW, SOIC 8-pin DIP, JW, SOIC 8-pin DIP, JW, SOIC 8-pin DIP, JW 8-pin DIP, JW All PIC12CXXX & PIC12CEXXX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC12CXXX & PIC12CEXXX devices use serial programming with data pin GP0 and clock pin GP1. 1998 Microchip Technology Inc. DS40139D-page 5 PIC12C5XX NOTES: DS40139D-page 6 1998 Microchip Technology Inc. PIC12C5XX 2.0 PIC12C5XX DEVICE VARIETIES A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC12C5XX Product Identification System at the back of this data sheet to specify the correct part number. 2.1 UV Erasable Devices The UV erasable version, offered in ceramic side brazed package, is optimal for prototype development and pilot programs. The UV erasable version can be erased and reprogrammed to any of the configuration modes. Note: Please note that erasing the device will also erase the pre-programmed internal calibration value for the internal oscillator. The calibration value must be saved prior to erasing the part. Microchip's PICSTART PLUS and PRO MATE programmers all support programming of the PIC12C5XX. Third party programmers also are available; refer to the Microchip Third Party Guide for a list of sources. 2.2 2.3 Quick-Turnaround-Production (QTP) Devices Microchip offers a QTP Programming Service for factory production orders. This service is made available for users who choose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices but with all EPROM locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2.4 Serialized Quick-Turnaround Production (SQTPSM) Devices Microchip offers a unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number which can serve as an entry-code, password or ID number. One-Time-Programmable (OTP) Devices The availability of OTP devices is especially useful for customers who need the flexibility for frequent code updates or small volume applications. The OTP devices, packaged in plastic packages permit the user to program them once. In addition to the program memory, the configuration bits must also be programmed. 1998 Microchip Technology Inc. DS40139D-page 7 PIC12C5XX NOTES: DS40139D-page 8 1998 Microchip Technology Inc. PIC12C5XX 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC12C5XX family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC12C5XX uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architecture where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12-bits wide making it possible to have all single word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (1s @ 4MHz) except for program branches. The table below lists program memory (EPROM) and data memory (RAM) for each PIC12C5XX device. Device PIC12C508 PIC12C508A PIC12C509 PIC12C509A EPROM RAM 512 x 12 512 x 12 1024 x 12 1024 x 12 25 25 41 41 The PIC12C5XX device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-1, with the corresponding device pins described in Table 3-1. The PIC12C5XX can directly or indirectly address its register files and data memory. All special function registers including the program counter are mapped in the data memory. The PIC12C5XX has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any addressing mode. This symmetrical nature and lack of `special optimal situations' make programming with the PIC12C5XX simple yet efficient. In addition, the learning curve is reduced significantly. 1998 Microchip Technology Inc. DS40139D-page 9 PIC12C5XX FIGURE 3-1: PIC12C5XX BLOCK DIAGRAM 12 EPROM 512 x 12 or 1024 x 12 Program Memory 8 Data Bus Program Counter GP0 GP1 GP2/T0CKI GP3/MCLR/Vpp GP4/OSC2 GP5/OSC1/CLKIN RAM 25 x 8 or 41 x 8 File Registers STACK1 STACK2 Program 12 Bus RAM Addr GPIO 9 Addr MUX Instruction reg Direct Addr 5 5-7 Indirect Addr FSR reg STATUS reg 8 3 MUX Device Reset Timer Instruction Decode & Control OSC1/CLKIN OSC2 Timing Generation Internal RC OSC Power-on Reset Watchdog Timer ALU 8 W reg Timer0 MCLR Vdd, Vss DS40139D-page 10 1998 Microchip Technology Inc. PIC12C5XX TABLE 3-1: PIC12C5XX PINOUT DESCRIPTION DIP Pin # SOIC Pin # I/O/P Type GP0 7 7 I/O TTL/ST Bi-directional I/O port/ serial programming data. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. GP1 6 6 I/O TTL/ST Bi-directional I/O port/ serial programming clock. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. GP2/T0CKI 5 5 I/O GP3/MCLR/VPP 4 4 I GP4/OSC2 3 3 I/O GP5/OSC1/CLKIN 2 2 I/O VDD 1 1 P -- Positive supply for logic and I/O pins VSS 8 8 P -- Ground reference for logic and I/O pins Name Buffer Type ST Description Bi-directional I/O port. Can be configured as T0CKI. TTL/ST Input port/master clear (reset) input/programming voltage input. When configured as MCLR, this pin is an active low reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter programming mode. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. Weak pull-up always on if configured as MCLR. ST when in MCLR mode. TTL Bi-directional I/O port/oscillator crystal output. Connections to crystal or resonator in crystal oscillator mode (XT and LP modes only, GPIO in other modes). TTL/ST Bidirectional IO port/oscillator crystal input/external clock source input (GPIO in Internal RC mode only, OSC1 in all other oscillator modes). TTL input when GPIO, ST input in external RC oscillator mode. Legend: I = input, O = output, I/O = input/output, P = power, -- = not used, TTL = TTL input, ST = Schmitt Trigger input 1998 Microchip Technology Inc. DS40139D-page 11 PIC12C5XX 3.1 Clocking Scheme/Instruction Cycle 3.2 The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter is incremented every Q1, and the instruction is fetched from program memory and latched into instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. Instruction Flow/Pipelining An Instruction Cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3, and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q2 Q1 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal phase clock Q3 Q4 PC PC PC+1 Fetch INST (PC) Execute INST (PC-1) EXAMPLE 3-1: PC+2 Fetch INST (PC+1) Execute INST (PC) Fetch INST (PC+2) Execute INST (PC+1) INSTRUCTION PIPELINE FLOW 1. MOVLW 03H 2. MOVWF GPIO 3. CALL SUB_1 4. BSF GPIO, BIT1 Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed. DS40139D-page 12 1998 Microchip Technology Inc. PIC12C5XX 4.0 MEMORY ORGANIZATION PIC12C5XX memory is organized into program memory and data memory. For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one STATUS register bit. For the PIC12C509(A) with a data memory register file of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR). FIGURE 4-1: PROGRAM MEMORY MAP AND STACK FOR THE PIC12C5XX PC<11:0> 12 CALL, RETLW Stack Level 1 Stack Level 2 Reset Vector (note 1) The PIC12C5XX devices have a 12-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. On-chip Program Memory Only the first 512 x 12 (0000h-01FFh) for the PIC12C508(A) and 1K x 12 (0000h-03FFh) for the PIC12C509(A) are physically implemented. Refer to Figure 4-1. Accessing a location above these boundaries will cause a wrap-around within the first 512 x 12 space (PIC12C508(A)) or 1K x 12 space (PIC12C509(A)). The effective reset vector is at 000h, (see Figure 4-1). Location 01FFh (PIC12C508(A)) or location 03FFh (PIC12C509(A)) contains the internal clock oscillator calibration value. This value should never be overwritten. User Memory Space Program Memory Organization 4.1 512 Word (PIC12C508(A)) 0000h 01FFh 0200h On-chip Program Memory 1024 Word (PIC12C509(A)) 03FFh 0400h 7FFh Note 1: Address 0000h becomes the effective reset vector. Location 01FFh (PIC12C508(A)) or location 03FFh (PIC12C509(A)) contains the MOVLW XX INTERNAL RC oscillator calibration value. 1998 Microchip Technology Inc. DS40139D-page 13 PIC12C5XX 4.2 Data Memory Organization FIGURE 4-2: Data memory is composed of registers, or bytes of RAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: special function registers and general purpose registers. PIC12C508(A) REGISTER FILE MAP File Address The special function registers include the TMR0 register, the Program Counter (PC), the Status Register, the I/O registers (ports), and the File Select Register (FSR). In addition, special purpose registers are used to control the I/O port configuration and prescaler options. The general purpose registers are used for data and control information under command of the instructions. 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO 07h For the PIC12C508(A), the register file is composed of 7 special function registers and 25 general purpose registers (Figure 4-2). General Purpose Registers For the PIC12C509(A), the register file is composed of 7 special function registers, 25 general purpose registers, and 16 general purpose registers that may be addressed using a banking scheme (Figure 4-3). 4.2.1 1Fh GENERAL PURPOSE REGISTER FILE Note 1: Not a physical register. See Section 4.8 The general purpose register file is accessed either directly or indirectly through the file select register FSR (Section 4.8). FIGURE 4-3: PIC12C509(A) REGISTER FILE MAP FSR<6:5> 00 01 File Address 00h INDF(1) 01h TMR0 02h PCL 03h STATUS 04h FSR 05h OSCCAL 06h GPIO 20h Addresses map back to addresses in Bank 0. 07h General Purpose Registers 2Fh 0Fh 30h 10h General Purpose Registers 1Fh 3Fh Bank 0 Note 1: DS40139D-page 14 General Purpose Registers Bank 1 Not a physical register. See Section 4.8 1998 Microchip Technology Inc. PIC12C5XX 4.2.2 The special registers can be classified into two sets. The special function registers associated with the "core" functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature. SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). TABLE 4-1: Address SPECIAL FUNCTION REGISTER (SFR) SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets(2) N/A TRIS I/O control registers --11 1111 --11 1111 N/A OPTION Contains control bits to configure Timer0, Timer0/WDT prescaler, wake-up on change, and weak pull-ups 1111 1111 1111 1111 00h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu TMR0 8-bit real-time clock/counter xxxx xxxx uuuu uuuu PCL Low order 8 bits of PC 1111 1111 1111 1111 0001 1xxx q00q quuu(3) 01h 02h (1) 03h STATUS GPWUF -- PA0 TO PD Z DC 04h FSR (12C508/ 12C508A) Indirect data memory address pointer 111x xxxx 111u uuuu 04h FSR (12C509/ 12C509A) Indirect data memory address pointer 110x xxxx 11uu uuuu 05h OSCCAL (12C508/ 12C509) -- 0111 ---- uuuu ---- -- C CAL3 CAL2 CAL1 CAL0 -- -- CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 -- -- 1000 00-- uuuu uu-- -- -- GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu OSCCAL (12C508A/ 12C509A) 05h 06h GPIO Legend: Shaded boxes = unimplemented or unused, -- = unimplemented, read as '0' (if applicable) x = unknown, u = unchanged, q = see the tables in Section 7.7 for possible values. Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6 for an explanation of how to access these bits. 2: Other (non power-up) resets include external reset through MCLR, watchdog timer and wake-up on pin change reset. 3: If reset was due to wake-up on pin change then bit 7 = 1. All other resets will cause bit 7 = 0. 1998 Microchip Technology Inc. DS40139D-page 15 PIC12C5XX 4.3 STATUS Register For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). This register contains the arithmetic status of the ALU, the RESET status, and the page preselect bit for program memories larger than 512 words. It is recommended, therefore, that only BCF, BSF and MOVWF instructions be used to alter the STATUS register because these instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions, which do affect STATUS bits, see Instruction Set Summary. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. FIGURE 4-4: R/W-0 GPWUF bit7 STATUS REGISTER (ADDRESS:03h) R/W-0 -- R/W-0 PA0 R-1 TO R-1 PD R/W-x Z R/W-x DC 6 5 4 3 2 1 R/W-x C bit0 R = Readable bit W = Writable bit - n = Value at POR reset bit 7: GPWUF: GPIO reset bit 1 = Reset due to wake-up from SLEEP on pin change 0 = After power up or other reset bit 6: Unimplemented bit 5: PA0: Program page preselect bits 1 = Page 1 (200h - 3FFh) - PIC12C509(A) 0 = Page 0 (000h - 1FFh) - PIC12C508(A) and PIC12C509(A) Each page is 512 bytes. Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program page preselect is not recommended since this may affect upward compatibility with future products. bit 4: TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3: PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2: Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1: DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF 1 = A carry from the 4th low order bit of the result occurred 0 = A carry from the 4th low order bit of the result did not occur SUBWF 1 = A borrow from the 4th low order bit of the result did not occur 0 = A borrow from the 4th low order bit of the result occurred bit 0: C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF SUBWF 1 = A carry occurred 1 = A borrow did not occur 0 = A carry did not occur 0 = A borrow occurred DS40139D-page 16 RRF or RLF Load bit with LSB or MSB, respectively 1998 Microchip Technology Inc. PIC12C5XX 4.4 OPTION Register Note: If TRIS bit is set to `0', the wake-up on change and pull-up functions are disabled for that pin; i.e., note that TRIS overrides OPTION control of GPPU and GPWU. Note: If the T0CS bit is set to `1', GP2 is forced to be an input even if TRIS GP2 = `0'. The OPTION register is a 8-bit wide, write-only register which contains various control bits to configure the Timer0/WDT prescaler and Timer0. By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A RESET sets the OPTION<7:0> bits. FIGURE 4-5: W-1 GPWU bit7 OPTION REGISTER W-1 GPPU 6 W-1 T0CS 5 W-1 T0SE 4 W-1 PSA 3 W-1 PS2 2 bit 7: GPWU: Enable wake-up on pin change (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 6: GPPU: Enable weak pull-ups (GP0, GP1, GP3) 1 = Disabled 0 = Enabled bit 5: T0CS: Timer0 clock source select bit 1 = Transition on T0CKI pin 0 = Transition on internal instruction cycle clock, Fosc/4 bit 4: T0SE: Timer0 source edge select bit 1 = Increment on high to low transition on the T0CKI pin 0 = Increment on low to high transition on the T0CKI pin bit 3: PSA: Prescaler assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0: PS2:PS0: Prescaler rate select bits Bit Value Timer0 Rate WDT Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1998 Microchip Technology Inc. W-1 PS1 1 W-1 PS0 bit0 W = Writable bit U = Unimplemented bit - n = Value at POR reset Reference Table 4-1 for other resets. DS40139D-page 17 PIC12C5XX 4.5 OSCCAL Register The Oscillator Calibration (OSCCAL) register is used to calibrate the internal 4 MHz oscillator. It contains four to six bits for calibration. Increasing the cal value increases the frequency. See Section 7.2.5 for more information on the internal oscillator. FIGURE 4-6: R/W-0 CAL3 bit7 OSCCAL REGISTER (ADDRESS 8Fh) R/W-1 CAL2 R/W-1 CAL1 R/W-1 CAL0 R/W-0 -- R/W-0 -- U-0 -- U-0 -- bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 7-4: CAL<3:0>: Calibration bit 3-0: Unimplemented: Read as '0' FIGURE 4-7: R/W-1 CAL5 bit7 OSCCAL REGISTER (ADDRESS 8Fh)PIC12C508A/C509A R/W-0 CAL4 R/W-0 CAL3 R/W-0 CAL2 R/W-0 CAL1 R/W-0 CAL0 U-0 -- U-0 -- bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 7-2: CAL<5:0>: Calibration bit 1-0: Unimplemented: Read as '0' DS40139D-page 18 1998 Microchip Technology Inc. PIC12C5XX 4.6 Program Counter 4.6.1 EFFECTS OF RESET As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. The Program Counter is set upon a RESET, which means that the PC addresses the last location in the last page i.e., the oscillator calibration instruction. After executing MOVLW XX, the PC will roll over to location 00h, and begin executing user code. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The PC Latch (PCL) is mapped to PC<7:0>. Bit 5 of the STATUS register provides page information to bit 9 of the PC (Figure 48). The STATUS register page preselect bits are cleared upon a RESET, which means that page 0 is preselected. For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-8). Instructions where the PCL is the destination, or Modify PCL instructions, include MOVWF PC, ADDWF PC, and BSF PC,5. Note: Because PC<8> is cleared in the CALL instruction, or any Modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). FIGURE 4-8: LOADING OF PC BRANCH INSTRUCTIONS PIC12C5XX GOTO Instruction 11 10 9 8 7 0 PC Instruction Word 0 CALL or Modify PCL Instruction 8 7 PIC12C5XX devices have a 12-bit wide L.I.F.O. hardware push/pop stack. A CALL instruction will push the current value of stack 1 into stack 2 and then push the current program counter value, incremented by one, into stack level 1. If more than two sequential CALL's are executed, only the most recent two return addresses are stored. A RETLW instruction will pop the contents of stack level 1 into the program counter and then copy stack level 2 contents into level 1. If more than two sequential RETLW's are executed, the stack will be filled with the address previously stored in level 2. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. Note 2: There are no instructions mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL and RETLW instructions. STATUS 9 Stack Note 1: There are no STATUS bits to indicate stack overflows or stack underflow conditions. PA0 11 10 4.7 Upon any reset, the contents of the stack remain unchanged, however the program counter (PCL) will also be reset to 0. PCL 7 Therefore, upon a RESET, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered. 0 PC PCL Instruction Word Reset to `0' PA0 7 0 STATUS 1998 Microchip Technology Inc. DS40139D-page 19 PIC12C5XX 4.8 Indirect Data Addressing; INDF and FSR Registers EXAMPLE 4-2: The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing. EXAMPLE 4-1: INDIRECT ADDRESSING NEXT movlw movwf clrf incf btfsc goto HOW TO CLEAR RAM USING INDIRECT ADDRESSING 0x10 FSR INDF FSR,F FSR,4 NEXT ;initialize pointer ; to RAM ;clear INDF register ;inc pointer ;all done? ;NO, clear next CONTINUE * * * * Register file 07 contains the value 10h Register file 08 contains the value 0Ah Load the value 07 into the FSR register A read of the INDF register will return the value of 10h * Increment the value of the FSR register by one (FSR = 08) * A read of the INDR register now will return the value of 0Ah. : ;YES, continue The FSR is a 5-bit wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. PIC12C508(A): Does not use banking. FSR<7:5> are unimplemented and read as '1's. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected). PIC12C509(A): Uses FSR<5>. Selects between bank 0 and bank 1. FSR<7:6> is unimplemented, read as '1' . A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-2. FIGURE 4-9: DIRECT/INDIRECT ADDRESSING Direct Addressing (FSR) 6 5 4 bank select location select Indirect Addressing (opcode) 0 6 5 4 bank 00 (FSR) 0 location select 01 00h Addresses map back to addresses in Bank 0. Data Memory(1) 0Fh 10h 1Fh Bank 0 3Fh Bank 1(2) Note 1: For register map detail see Section 4.2. Note 2: PIC12C509(A) only DS40139D-page 20 1998 Microchip Technology Inc. PIC12C5XX 5.0 I/O PORT 5.3 As with any other register, the I/O register can be written and read under program control. However, read instructions (e.g., MOVF GPIO,W) always read the I/O pins independent of the pin's input/output modes. On RESET, all I/O ports are defined as input (inputs are at hi-impedance) since the I/O control registers are all set. 5.1 The equivalent circuit for an I/O port pin is shown in Figure 5-1. All port pins, except GP3 which is input only, may be used for both input and output operations. For input operations these ports are nonlatching. Any input must be present until read by an input instruction (e.g., MOVF GPIO,W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except GP3) can be programmed individually as input or output. GPIO GPIO is an 8-bit I/O register. Only the low order 6 bits are used (GP5:GP0). Bits 7 and 6 are unimplemented and read as '0's. Please note that GP3 is an input only pin. The configuration word can set several I/O's to alternate functions. When acting as alternate functions the pins will read as `0' during port read. Pins GP0, GP1, and GP3 can be configured with weak pull-ups and also with wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If pin 4 is configured as MCLR, weak pullup is always on and wake-up on change for this pin is not enabled. 5.2 FIGURE 5-1: EQUIVALENT CIRCUIT FOR A SINGLE I/O PIN Data Bus D TRIS Register W Reg Q Data Latch WR Port The output driver control register is loaded with the contents of the W register by executing the TRIS f instruction. A '1' from a TRIS register bit puts the corresponding output driver in a hi-impedance mode. A '0' puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are GP3 which is input only and GP2 which may be controlled by the option register, see Figure 45. Note: I/O Interfacing VDD Q CK P N D Q TRIS Latch TRIS `f' CK VSS Q Reset A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low. I/O pin(1) (2) RD Port Note 1: I/O pins have protection diodes to VDD and VSS. 2: See Table 3-1 for buffer type. The TRIS registers are "write-only" and are set (output drivers disabled) upon RESET. TABLE 5-1: Address SUMMARY OF PORT REGISTERS Name N/A TRIS N/A OPTION 03H STATUS 06h GPIO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 I/O control registers Value on Power-On Reset Value on All Other Resets --11 1111 --11 1111 GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 GPWUF -- PAO TO PD Z DC C 0001 1xxx q00q quuu(1) -- -- GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu Legend: Shaded cells not used by Port Registers, read as `0', -- = unimplemented, read as '0', x = unknown, u = unchanged, q = see tables in Section 7.7 for possible values. Note 1: If reset was due to wake-up on change, then bit 7 = 1. All other resets will cause bit 7 = 0. 1998 Microchip Technology Inc. DS40139D-page 21 PIC12C5XX 5.4 I/O Programming Considerations 5.4.1 BI-DIRECTIONAL I/O PORTS Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit5 of GPIO will cause all eight bits of GPIO to be read into the CPU, bit5 to be set and the GPIO value to be written to the output latches. If another bit of GPIO is used as a bidirectional I/O pin (say bit0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the input mode, no problem occurs. However, if bit0 is switched into output mode later on, the content of the data latch may now be unknown. Example 5-1 shows the effect of two sequential readmodify-write instructions (e.g., BCF, BSF, etc.) on an I/ O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin ("wired-or", "wired-and"). The resulting high output currents may damage the chip. FIGURE 5-2: EXAMPLE 5-1: READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT ;Initial GPIO Settings ; GPIO<5:3> Inputs ; GPIO<2:0> Outputs ; ; GPIO latch GPIO pins ; ---------- ---------BCF GPIO, 5 ;--01 -ppp --11 pppp BCF GPIO, 4 ;--10 -ppp --11 pppp MOVLW 007h ; TRIS GPIO ;--10 -ppp --11 pppp ; ;Note that the user may have expected the pin ;values to be --00 pppp. The 2nd BCF caused ;GP5 to be latched as the pin value (High). 5.4.2 SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction, which causes that file to be read into the CPU, is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. SUCCESSIVE I/O OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction fetched MOVWF GPIO PC + 1 MOVF GPIO,W PC + 2 PC + 3 NOP NOP GP5:GP0 Port pin written here Instruction executed DS40139D-page 22 MOVWF GPIO (Write to GPIO) Port pin sampled here MOVF GPIO,W (Read GPIO) This example shows a write to GPIO followed by a read from GPIO. Data setup time = (0.25 TCY - TPD) where: TCY = instruction cycle. TPD = propagation delay Therefore, at higher clock frequencies, a write followed by a read may be problematic. NOP 1998 Microchip Technology Inc. PIC12C5XX 6.0 TIMER0 MODULE AND TMR0 REGISTER Counter mode is selected by setting the T0CS bit (OPTION<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit (OPTION<4>) determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1. The Timer0 module has the following features: * 8-bit timer/counter register, TMR0 - Readable and writable * 8-bit software programmable prescaler * Internal or external clock select - Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two instruction cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register. FIGURE 6-1: The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 6.2 details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1. TIMER0 BLOCK DIAGRAM Data bus GP2/T0CKI Pin FOSC/4 0 PSout 1 1 Programmable Prescaler(2) 0 T0SE 8 Sync with Internal Clocks TMR0 reg PSout (2 TCY delay) Sync 3 T0CS(1) PS2, PS1, PS0(1) PSA(1) Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer (Figure 6-5). 1998 Microchip Technology Inc. DS40139D-page 23 PIC12C5XX FIGURE 6-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC (Program Counter) PC-1 Instruction Fetch T0 Timer0 PC PC+1 MOVWF TMR0 MOVF TMR0,W T0+1 T0+2 Instruction Executed PC+4 PC+5 MOVF TMR0,W Read TMR0 reads NT0 NT0+1 Read TMR0 reads NT0 Read TMR0 reads NT0 + 1 Read TMR0 reads NT0 PC+6 MOVF TMR0,W NT0+2 Read TMR0 reads NT0 + 2 TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC (Program Counter) PC-1 Instruction Fetch PC PC+1 MOVWF TMR0 MOVF TMR0,W PC+3 MOVF TMR0,W MOVF TMR0,W PC+4 PC+5 MOVF TMR0,W Write TMR0 executed Read TMR0 reads NT0 Read TMR0 reads NT0 PC+6 MOVF TMR0,W NT0+1 NT0 Instruction Execute TABLE 6-1: PC+2 T0+1 T0 Timer0 Address PC+3 MOVF TMR0,W NT0 Write TMR0 executed FIGURE 6-3: PC+2 MOVF TMR0,W Read TMR0 reads NT0 Read TMR0 reads NT0 T0 Read TMR0 reads NT0 + 1 REGISTERS ASSOCIATED WITH TIMER0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on All Other Resets xxxx xxxx uuuu uuuu 01h TMR0 Timer0 - 8-bit real-time clock/counter N/A OPTION GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 N/A TRIS -- -- GP5 GP4 GP3 GP2 GP1 GP0 --11 1111 --11 1111 Legend: Shaded cells not used by Timer0, - = unimplemented, x = unknown, u = unchanged, DS40139D-page 24 1998 Microchip Technology Inc. PIC12C5XX 6.1 Using Timer0 with an External Clock When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-4). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. 6.1.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-4 shows the delay from the external clock edge to the timer incrementing. 6.1.3 OPTION REGISTER EFFECT ON GP2 TRIS If the option register is set to read TIMER0 from the pin, the port is forced to an input regardless of the TRIS register setting. FIGURE 6-4: TIMER0 TIMING WITH EXTERNAL CLOCK Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 External Clock Input or Prescaler Output (2) Q1 Q2 Q3 Q4 Small pulse misses sampling (1) External Clock/Prescaler Output After Sampling (3) Increment Timer0 (Q4) Timer0 T0 T0 + 1 T0 + 2 Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 1998 Microchip Technology Inc. DS40139D-page 25 PIC12C5XX 6.2 Prescaler EXAMPLE 6-1: An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer (WDT), respectively (Section 7.6). For simplicity, this counter is being referred to as "prescaler" throughout this data sheet. Note that the prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT, and vice-versa. 1.CLRWDT 2.CLRF TMR0 3.MOVLW '00xx1111'b 4.OPTION ;Clear WDT ;Clear TMR0 & Prescaler ;These 3 lines (5, 6, 7) ; are required only if ; desired 5.CLRWDT ;PS<2:0> are 000 or 001 6.MOVLW '00xx1xxx'b ;Set Postscaler to 7.OPTION ; desired WDT rate To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler. The PSA and PS2:PS0 bits (OPTION<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a RESET, the prescaler contains all '0's. 6.2.1 EXAMPLE 6-2: CHANGING PRESCALER (WDTTIMER0) CLRWDT MOVLW 'xxxx0xxx' SWITCHING PRESCALER ASSIGNMENT ;Clear WDT and ;prescaler ;Select TMR0, new ;prescale value and ;clock source OPTION The prescaler assignment is fully under software control (i.e., it can be changed "on the fly" during program execution). To avoid an unintended device RESET, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT. FIGURE 6-5: CHANGING PRESCALER (TIMER0WDT) BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER TCY ( = Fosc/4) Data Bus 0 GP2/T0CKI Pin 1 8 M U X 1 M U X 0 T0SE T0CS 0 Watchdog Timer 1 M U X Sync 2 Cycles TMR0 reg PSA 8-bit Prescaler 8 8 - to - 1MUX PS2:PS0 PSA WDT Enable bit 1 0 MUX PSA WDT Time-Out Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. DS40139D-page 26 1998 Microchip Technology Inc. PIC12C5XX 7.0 SPECIAL FEATURES OF THE CPU The PIC12C5XX has a Watchdog Timer which can be shut off only through configuration bit WDTE. It runs off of its own RC oscillator for added reliability. If using XT or LP selectable oscillator options, there is always an 18 ms (nominal) delay provided by the Device Reset Timer (DRT), intended to keep the chip in reset until the crystal oscillator is stable. If using INTRC or EXTRC there is an 18 ms delay only on VDD power-up. With this timer on-chip, most applications need no external reset circuitry. What sets a microcontroller apart from other processors are special circuits to deal with the needs of real-time applications. The PIC12C5XX family of microcontrollers has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These features are: The SLEEP mode is designed to offer a very low current power-down mode. The user can wake-up from SLEEP through a change on input pins or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application, including an internal 4 MHz oscillator. The EXTRC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options. * Oscillator selection * Reset - Power-On Reset (POR) - Device Reset Timer (DRT) - Wake-up from SLEEP on pin change * Watchdog Timer (WDT) * SLEEP * Code protection * ID locations * In-circuit Serial Programming FIGURE 7-1: 7.1 Configuration Bits The PIC12C5XX configuration word consists of 12 bits. Configuration bits can be programmed to select various device configurations. Two bits are for the selection of the oscillator type, one bit is the Watchdog Timer enable bit, and one bit is the MCLR enable bit. CONFIGURATION WORD FOR PIC12C5XX -- -- -- -- -- -- -- MCLRE CP bit11 10 9 8 7 6 5 4 3 WDTE FOSC1 FOSC0 2 1 bit0 Register: Address(1): CONFIG FFFh bit 11-5: Unimplemented bit 4: MCLRE: MCLR enable bit. 1 = MCLR pin enabled 0 = MCLR tied to VDD, (Internally) bit 3: CP: Code protection bit. 1 = Code protection off 0 = Code protection on bit 2: WDTE: Watchdog timer enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0: FOSC1:FOSC0: Oscillator selection bits 11 = EXTRC - external RC oscillator 10 = INTRC - internal RC oscillator 01 = XT oscillator 00 = LP oscillator Note 1: Refer to the PIC12C5XX Programming Specifications to determine how to access the configuration word. This register is not user addressable during device operation. 1998 Microchip Technology Inc. DS40139D-page 27 PIC12C5XX 7.2 Oscillator Configurations 7.2.1 OSCILLATOR TYPES TABLE 7-1: The PIC12C5XX can be operated in four different oscillator modes. The user can program two configuration bits (FOSC1:FOSC0) to select one of these four modes: * * * * LP: XT: INTRC: EXTRC: 7.2.2 Low Power Crystal Crystal/Resonator Internal 4 MHz Oscillator External Resistor/Capacitor Osc Type CRYSTAL OPERATION (OR CERAMIC RESONATOR) (XT OR LP OSC CONFIGURATION) C1(1) OSC1 Cap. Range C1 Cap. Range C2 XT 4.0 MHz 30 pF 30 pF These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. CRYSTAL OSCILLATOR / CERAMIC RESONATORS FIGURE 7-2: Resonator Freq TABLE 7-2: In XT or LP modes, a crystal or ceramic resonator is connected to the GP5/OSC1/CLKIN and GP4/OSC2 pins to establish oscillation (Figure 7-2). The PIC12C5XX oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT or LP modes, the device can have an external clock source drive the GP5/ OSC1/CLKIN pin (Figure 7-3). CAPACITOR SELECTION FOR CERAMIC RESONATORS - PIC12C5XX Osc Type CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR - PIC12C5XX Resonator Freq Cap.Range C1 Cap. Range C2 15 pF 15 pF 32 kHz(1) 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF Note 1: For VDD > 4.5V, C1 = C2 30 pF is recommended. These values are for design guidance only. Rs may be required to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. LP XT PIC12C5XX SLEEP XTAL RS(2) RF(3) OSC2 To internal logic C2(1) Note 1: See Capacitor Selection tables for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF approximate value = 10 M. FIGURE 7-3: EXTERNAL CLOCK INPUT OPERATION (XT OR LP OSC CONFIGURATION) OSC1 PIC12C5XX Clock from ext. system Open DS40139D-page 28 OSC2 1998 Microchip Technology Inc. PIC12C5XX 7.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 7-4 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs. FIGURE 7-4: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT +5V To Other Devices 10k 74AS04 4.7k 74AS04 PIC12C5XX CLKIN 10k XTAL 10k 20 pF 20 pF Figure 7-5 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 7-5: EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT 330 To Other Devices PIC12C5XX 330 74AS04 74AS04 74AS04 7.2.4 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 7-6 shows how the R/C combination is connected to the PIC12C5XX. For Rext values below 2.2 k, the oscillator operation may become unstable, or stop completely. For very high Rext values (e.g., 1 M) the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping Rext between 3 k and 100 k. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. The Electrical Specifications sections show RC frequency variation from part to part due to normal process variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). Also, see the Electrical Specifications sections for variation of oscillator frequency due to VDD for given Rext/Cext values as well as frequency variation due to operating temperature for given R, C, and VDD values. FIGURE 7-6: EXTERNAL RC OSCILLATOR MODE VDD Rext OSC1 Cext Internal clock N PIC12C5XX VSS CLKIN 0.1 F XTAL 1998 Microchip Technology Inc. DS40139D-page 29 PIC12C5XX 7.2.5 INTERNAL 4 MHz RC OSCILLATOR The internal RC oscillator provides a fixed 4 MHz (nominal) system clock at VDD = 5V and 25C, see "Electrical Specifications" section for information on variation over voltage and temperature.. are TO, PD, and GPWUF bits. They are set or cleared differently in different reset situations. These bits are used in software to determine the nature of reset. See Table 7-3 for a full description of reset states of all registers. In addition, a calibration instruction is programmed into the top of memory which contains the calibration value for the internal RC oscillator. This location is never code protected regardless of the code protect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the reset vector. This will load the W register with the calibration value upon reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it. OSCCAL, when written to with the calibration value, will "trim" the internal oscillator to remove process variation from the oscillator frequency. . Note: Please note that erasing the device will also erase the pre-programmed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part. so it can be reprogrammed correctly later. For the PIC12C508A and PIC12C509A, bits <7:2>, CAL5-CAL0 are used for calibration. Adjusting CAL50 from 000000 to 111111 yields a higher clock speed. Note that bits 1 and 0 of OSCCAL are unimplemented and should be written as 0 when modifying OSCCAL for compatibility with future devices. For the PIC12C508 and PIC12C509, the lower 4 bits of the register are used. Writing a larger value in this location yields a higher clock speed. 7.3 RESET The device differentiates between various kinds of reset: a) Power on reset (POR) b) MCLR reset during normal operation c) MCLR reset during SLEEP d) WDT time-out reset during normal operation e) WDT time-out reset during SLEEP f) Wake-up from SLEEP on pin change Some registers are not reset in any way; they are unknown on POR and unchanged in any other reset. Most other registers are reset to "reset state" on poweron reset (POR), MCLR, WDT or wake-up on pin change reset during normal operation. They are not affected by a WDT reset during SLEEP or MCLR reset during SLEEP, since these resets are viewed as resumption of normal operation. The exceptions to this DS40139D-page 30 1998 Microchip Technology Inc. PIC12C5XX TABLE 7-3: RESET CONDITIONS FOR REGISTERS Register Address Power-on Reset MCLR Reset WDT time-out Wake-up on Pin Change W (PIC12C508/509) -- qqqq xxxx (1) qqqq uuuu (1) W (PIC12C508A/509A) -- qqqq qqxx (1) qqqq qquu (1) INDF 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PC 02h 1111 1111 1111 1111 STATUS 03h 0001 1xxx q00q quuu (2,3) FSR (12C508/12C508A) 04h 111x xxxx 111u uuuu FSR (12C509/12C509A) 04h 110x xxxx 11uu uuuu OSCCAL(12C508/509) 05h 0111 ---- uuuu ---- OSCCAL(12C508A/509A) 05h 1000 00-- uuuu uu-- GPIO 06h --xx xxxx --uu uuuu OPTION -- 1111 1111 1111 1111 TRIS -- --11 1111 --11 1111 Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Note 1: Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. Note 2: See Table 7-7 for reset value for specific conditions Note 3: If reset was due to wake-up on pin change, then bit 7 = 1. All other resets will cause bit 7 = 0. TABLE 7-4: RESET CONDITION FOR SPECIAL REGISTERS STATUS Addr: 03h PCL Addr: 02h Power on reset 0001 1xxx 1111 1111 MCLR reset during normal operation 000u uuuu 1111 1111 MCLR reset during SLEEP 0001 0uuu 1111 1111 WDT reset during SLEEP 0000 0uuu 1111 1111 WDT reset normal operation 0000 uuuu 1111 1111 Wake-up from SLEEP on pin change 1001 0uuu 1111 1111 Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0'. 1998 Microchip Technology Inc. DS40139D-page 31 PIC12C5XX 7.3.1 MCLR ENABLE This configuration bit when unprogrammed (left in the `1' state) enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD, and the pin is assigned to be a GPIO. See Figure 7-7. When pin GP3/MCLR/VPP is configured as MCLR, the internal pull-up is always on. FIGURE 7-7: MCLR SELECT MCLRE WEAK PULL-UP GP3/MCLR/VPP 7.4 INTERNAL MCLR Power-On Reset (POR) The PIC12C5XX family incorporates on-chip PowerOn Reset (POR) circuitry which provides an internal chip reset for most power-up situations. The on-chip POR circuit holds the chip in reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the GP3/MCLR/VPP pin as MCLR and tie thru a resistor to VDD or program the pin as GP3. An internal weak pull-up resistor is implemented using a transistor. Refer to Table 10-1 for the pull-up resistor ranges. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Electrical Specifications for details. When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, ...) must be met to ensure operation. If these conditions are not met, the device must be held in reset until the operating parameters are met. The Power-On Reset circuit and the Device Reset Timer (Section 7.5) circuit are closely related. On power-up, the reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms, it will reset the reset latch and thus end the onchip reset signal. A power-up example where MCLR is held low is shown in Figure 7-9. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of reset TDRT msec after MCLR goes high. In Figure 7-10, the on-chip Power-On Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be GP3.). The VDD is stable before the start-up timer times out and there is no problem in getting a proper reset. However, Figure 711 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR (and VDD) actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip is, therefore, not guaranteed to function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 7-10). Note: When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be meet to ensure operation. If these conditions are not met, the device must be held in reset until the operating conditions are met. For additional information refer to Application Notes "Power-Up Considerations" - AN522 and "Power-up Trouble Shooting" - AN607. A simplified block diagram of the on-chip Power-On Reset circuit is shown in Figure 7-8. DS40139D-page 32 1998 Microchip Technology Inc. PIC12C5XX FIGURE 7-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Power-Up Detect POR (Power-On Reset) VDD Pin Change Wake-up on pin change SLEEP GP3/MCLR/VPP WDT Time-out MCLRE RESET 8-bit Asynch Ripple Counter (Start-Up Timer) On-Chip DRT OSC S Q R Q CHIP RESET FIGURE 7-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW) VDD MCLR INTERNAL POR TDRT DRT TIME-OUT INTERNAL RESET FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME VDD MCLR INTERNAL POR TDRT DRT TIME-OUT INTERNAL RESET 1998 Microchip Technology Inc. DS40139D-page 33 PIC12C5XX FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME V1 VDD MCLR INTERNAL POR TDRT DRT TIME-OUT INTERNAL RESET When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 VDD min. 7.5 Device Reset Timer (DRT) In the PIC12C5XX, DRT runs from RESET and varies based on oscillator selection (see Table 7-5.) The DRT operates on an internal RC oscillator. The processor is kept in RESET as long as the DRT is active. The DRT delay allows VDD to rise above VDD min., and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a RESET condition for approximately 18 ms after MCLR has reached a logic high (VIHMCLR) level. Thus, programming GP3/MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases, allowing for savings in cost-sensitive and/or space restricted applications, as well as allowing the use of the GP3/ MCLR/VPP pin as a general purpose input. The Device Reset time delay will vary from chip to chip due to VDD, temperature, and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out. This is particularly important for applications using the WDT to wake from SLEEP mode automatically. DS40139D-page 34 7.6 Watchdog Timer (WDT) The Watchdog Timer (WDT) is a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the external RC oscillator of the GP5/OSC1/CLKIN pin and the internal 4 MHz oscillator. That means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or SLEEP, a WDT reset or wake-up reset generates a device RESET. The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer reset. The WDT can be permanently disabled by programming the configuration bit WDTE as a '0' (Section 7.1). Refer to the PIC12C5XX Programming Specifications to determine how to access the configuration word. TABLE 7-5: Oscillator Configuration DRT (DEVICE RESET TIMER PERIOD) POR Reset Subsequent Resets IntRC & ExtRC 18 ms (typical) 300 s (typical) XT & LP 18 ms (typical) 18 ms (typical) 1998 Microchip Technology Inc. PIC12C5XX 7.6.1 7.6.2 WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-topart process variations (see DC specs). WDT PROGRAMMING CONSIDERATIONS The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device RESET. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum SLEEP time before a WDT wake-up reset. Under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. FIGURE 7-12: WATCHDOG TIMER BLOCK DIAGRAM From Timer0 Clock Source (Figure 6-5) 0 1 Watchdog Timer M U X Postscaler Postscaler 8 - to - 1 MUX PS2:PS0 PSA WDT Enable Configuration Bit To Timer0 (Figure 6-4) 1 0 PSA MUX Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. WDT Time-out TABLE 7-6: Address N/A SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER Name OPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset GPWU GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 Value on All Other Resets 1111 1111 Legend: Shaded boxes = Not used by Watchdog Timer, -- = unimplemented, read as '0', u = unchanged 1998 Microchip Technology Inc. DS40139D-page 35 PIC12C5XX 7.7 Time-Out Sequence, Power Down, and Wake-up from SLEEP Status Bits (TO/PD/GPWUF) The TO, PD, and GPWUF bits in the STATUS register can be tested to determine if a RESET condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) reset. TABLE 7-7: GPWUF TO TO/PD/GPWUF STATUS AFTER RESET PD 0 0 0 0 0 u 0 1 0 0 1 1 0 u u 1 1 0 Legend: RESET caused by WDT wake-up from SLEEP WDT time-out (not from SLEEP) MCLR wake-up from SLEEP Power-up MCLR not during SLEEP Wake-up from SLEEP on pin change Legend: u = unchanged Note 1: The TO, PD, and GPWUF bits maintain their status (u) until a reset occurs. A low-pulse on the MCLR input does not change the TO, PD, and GPWUF status bits. 7.8 Reset on Brown-Out A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. To reset PIC12C5XX devices when a brown-out occurs, external brown-out protection circuits may be built, as shown in Figure 7-13 and Figure 7-14. FIGURE 7-13: BROWN-OUT PROTECTION CIRCUIT 1 VDD VDD 33k 10k Q1 MCLR 40k* PIC12C5XX This circuit will activate reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). *Refer to Figure 7-7 and Table 10-1 for internal weak pullup on MCLR. FIGURE 7-14: BROWN-OUT PROTECTION CIRCUIT 2 VDD VDD R1 Q1 MCLR R2 40k* PIC12C5XX This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD * R1 R1 + R2 = 0.7V *Refer to Figure 7-7 and Table 10-1 for internal weak pull-up on MCLR. DS40139D-page 36 1998 Microchip Technology Inc. PIC12C5XX 7.9 Power-Down Mode (SLEEP) A device may be powered down (SLEEP) and later powered up (Wake-up from SLEEP). 7.9.1 SLEEP The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (STATUS<4>) is set, the PD bit (STATUS<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low, or hi-impedance). It should be noted that a RESET generated by a WDT time-out does not drive the MCLR pin low. 7.10 Program Verification/Code Protection If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location can be read regardless of the code protection bit setting. 7.11 ID Locations Four memory locations are designated as ID locations where the user can store checksum or other codeidentification numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as '0's. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the GP3/ MCLR/VPP pin must be at a logic high level (VIHMC) if MCLR is enabled. 7.9.2 WAKE-UP FROM SLEEP The device can wake-up from SLEEP through one of the following events: 1. 2. 3. An external reset input on GP3/MCLR/VPP pin, when configured as MCLR. A Watchdog Timer time-out reset (if WDT was enabled). A change on input pin GP0, GP1, or GP3/ MCLR/VPP when wake-up on change is enabled. These events cause a device reset. The TO, PD, and GPWUF bits can be used to determine the cause of device reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The GPWUF bit indicates a change in state while in SLEEP at pins GP0, GP1, or GP3 (since the last time there was a file or bit operation on GP port). Caution: Right before entering SLEEP, read the input pins. When in SLEEP, wake up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before reentering SLEEP, a wake up will occur immediately even if no pins change while in SLEEP mode. The WDT is cleared when the device wakes from sleep, regardless of the wake-up source. 1998 Microchip Technology Inc. DS40139D-page 37 PIC12C5XX 7.12 In-Circuit Serial Programming The PIC12C5XX microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a program/verify mode by holding the GP1 and GP0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). GP1 becomes the programming clock and GP0 becomes the programming data. Both GP1 and GP0 are Schmitt Trigger inputs in this mode. After reset, a 6-bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC12C5XX Programming Specifications. FIGURE 7-15: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION External Connector Signals To Normal Connections PIC12C5XX +5V VDD 0V VSS VPP MCLR/VPP CLK GP1 Data I/O GP0 VDD To Normal Connections A typical in-circuit serial programming connection is shown in Figure 7-15. DS40139D-page 38 1998 Microchip Technology Inc. PIC12C5XX 8.0 INSTRUCTION SET SUMMARY Each PIC12C5XX instruction is a 12-bit word divided into an OPCODE, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The PIC12C5XX instruction set summary in Table 8-2 groups the instructions into byte-oriented, bit-oriented, and literal and control operations. Table 8-1 shows the opcode field descriptions. For byte-oriented instructions, 'f' represents a file register designator and 'd' represents a destination designator. The file register designator is used to specify which one of the 32 file registers is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If 'd' is '0', the result is placed in the W register. If 'd' is '1', the result is placed in the file register specified in the instruction. For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located. For literal and control operations, 'k' represents an 8 or 9-bit constant or literal value. TABLE 8-1: OPCODE FIELD DESCRIPTIONS Field Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Destination select; d = 0 (store result in W) d = 1 (store result in file register 'f') Default is d = 1 label Label name TOS Top of Stack PC WDT PD Power-Down bit GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 11 6 OPCODE 5 d 4 0 f (FILE #) d = 0 for destination W d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 OPCODE 8 7 5 4 b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 8 7 OPCODE 0 k (literal) k = 8-bit immediate value Literal and control operations - GOTO instruction 11 9 8 OPCODE 0 k (literal) k = 9-bit immediate value Destination, either the W register or the specified register file location [ ] Options ( ) Contents Assigned to <> Register bit field FIGURE 8-1: Watchdog Timer Counter Time-Out bit italics 0xhhh where 'h' signifies a hexadecimal digit. Program Counter TO dest Figure 8-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: Description f d All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. In the set of User defined term (font is courier) 1998 Microchip Technology Inc. DS40139D-page 39 PIC12C5XX TABLE 8-2: INSTRUCTION SET SUMMARY Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f,d f,d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d 12-Bit Opcode Description Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate left f through Carry Rotate right f through Carry Subtract W from f Swap f Exclusive OR W with f Cycles MSb LSb Status Affected Notes 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 0001 0001 0000 0000 0010 0000 0010 0010 0011 0001 0010 0000 0000 0011 0011 0000 0011 0001 11df 01df 011f 0100 01df 11df 11df 10df 11df 00df 00df 001f 0000 01df 00df 10df 10df 10df ffff ffff ffff 0000 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C,DC,Z Z Z Z Z Z None Z None Z Z None None C C C,DC,Z None Z 1,2,4 2,4 4 1 1 1 (2) 1 (2) 0100 0101 0110 0111 bbbf bbbf bbbf bbbf ffff ffff ffff ffff None None None None 2,4 2,4 1 2 1 2 1 1 1 2 1 1 1 1110 1001 0000 101k 1101 1100 0000 1000 0000 0000 1111 kkkk kkkk 0000 kkkk kkkk kkkk 0000 kkkk 0000 0000 kkkk kkkk kkkk 0100 kkkk kkkk kkkk 0010 kkkk 0011 0fff kkkk Z None TO, PD None Z None None None TO, PD None Z 2,4 2,4 2,4 2,4 2,4 2,4 1,4 2,4 2,4 1,2,4 2,4 2,4 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set LITERAL AND CONTROL OPERATIONS ANDLW CALL CLRWDT GOTO IORLW MOVLW OPTION RETLW SLEEP TRIS XORLW k k k k k k - k - f k AND literal with W Call subroutine Clear Watchdog Timer Unconditional branch Inclusive OR Literal with W Move Literal to W Load OPTION register Return, place Literal in W Go into standby mode Load TRIS register Exclusive OR Literal to W 1 3 Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except for GOTO. (Section 4.6) 2: When an I/O register is modified as a function of itself (e.g. MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 3: The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tristate latches of GPIO. A '1' forces the pin to a hi-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0). DS40139D-page 40 1998 Microchip Technology Inc. PIC12C5XX ADDWF Add W and f Syntax: [ label ] ADDWF ANDWF AND W with f Syntax: [ label ] ANDWF Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: (W) + (f) (dest) Operation: (W) .AND. (f) (dest) f,d Status Affected: C, DC, Z Encoding: 0001 f,d Status Affected: Z 11df ffff Encoding: 0001 01df ffff Description: Add the contents of the W register and register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'. Description: The contents of the W register are AND'ed with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'. Words: 1 Words: 1 Cycles: 1 Example: ADDWF FSR, 0 Before Instruction W = FSR = Cycles: 1 Example: ANDWF W = FSR = 0x17 0xC2 After Instruction After Instruction W = FSR = W = FSR = 0xD9 0xC2 ANDLW And literal with W Syntax: [ label ] ANDLW Operands: 0 k 255 Operation: (W).AND. (k) (W) k Status Affected: Z 1110 Description: kkkk 1 Cycles: 1 Example: ANDLW 0x5F Before Instruction W = 0xA3 After Instruction W kkkk The contents of the W register are AND'ed with the eight-bit literal 'k'. The result is placed in the W register. Words: = 1 Before Instruction 0x17 0xC2 Encoding: FSR, 0x17 0x02 BCF Bit Clear f Syntax: [ label ] BCF Operands: 0 f 31 0b7 Operation: 0 (f<b>) f,b Status Affected: None Encoding: 0100 bbbf ffff Description: Bit 'b' in register 'f' is cleared. Words: 1 Cycles: 1 Example: BCF FLAG_REG, 7 Before Instruction FLAG_REG = 0xC7 After Instruction FLAG_REG = 0x47 0x03 1998 Microchip Technology Inc. DS40139D-page 41 PIC12C5XX BSF Bit Set f Syntax: [ label ] BSF BTFSS Bit Test f, Skip if Set Syntax: [ label ] BTFSS f,b Operands: 0 f 31 0b7 Operands: 0 f 31 0b<7 Operation: 1 (f<b>) Operation: skip if (f<b>) = 1 f,b Status Affected: None Encoding: Description: Status Affected: None 0101 bbbf ffff Bit 'b' in register 'f' is set. Words: 1 Cycles: 1 Example: BSF FLAG_REG, Encoding: FLAG_REG = 0x8A Words: 1 Cycles: 1(2) Example: HERE FALSE TRUE BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0 f 31 0b7 Before Instruction skip if (f<b>) = 0 After Instruction Operation: Encoding: Description: 0110 bbbf ffff If bit 'b' in register 'f' is 0 then the next instruction is skipped. If bit 'b' is 0 then the next instruction fetched during the current instruction execution is discarded, and an NOP is executed instead, making this a 2 cycle instruction. Words: 1 Cycles: 1(2) Example: HERE FALSE TRUE * * PC Status Affected: None BTFSC GOTO ffff If bit 'b' in register 'f' is '1' then the next instruction is skipped. If bit 'b' is '1', then the next instruction fetched during the current instruction execution, is discarded and an NOP is executed instead, making this a 2 cycle instruction. Before Instruction After Instruction bbbf Description: 7 FLAG_REG = 0x0A 0111 If FLAG<1> PC if FLAG<1> PC BTFSS GOTO * FLAG,1 PROCESS_CODE = address (HERE) = = = = 0, address (FALSE); 1, address (TRUE) FLAG,1 PROCESS_CODE * * * Before Instruction PC = address (HERE) = = = = 0, address (TRUE); 1, address(FALSE) After Instruction if FLAG<1> PC if FLAG<1> PC DS40139D-page 42 1998 Microchip Technology Inc. PIC12C5XX CALL Subroutine Call CLRW Clear W Syntax: [ label ] CALL k Syntax: [ label ] CLRW Operands: 0 k 255 Operands: None Operation: (PC) + 1 Top of Stack; k PC<7:0>; (STATUS<6:5>) PC<10:9>; 0 PC<8> Operation: 00h (W); 1Z Status Affected: None Encoding: Description: 1001 kkkk kkkk Subroutine call. First, return address (PC+1) is pushed onto the stack. The eight bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two cycle instruction. 1 Cycles: 2 Example: HERE CALL 0100 0000 The W register is cleared. Zero bit (Z) is set. Words: 1 Cycles: 1 Example: CLRW Before Instruction W = 0x5A After Instruction address (THERE) address (HERE + 1) CLRF Clear f Syntax: [ label ] CLRF Operands: 0 f 31 Operation: 00h (f); 1Z f Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h WDT; 0 WDT prescaler (if assigned); 1 TO; 1 PD Status Affected: TO, PD Encoding: 011f The contents of register 'f' are cleared and the Z bit is set. Words: 1 Cycles: 1 Example: CLRF FLAG_REG Before Instruction = 0x5A = = 0x00 1 After Instruction FLAG_REG Z 1998 Microchip Technology Inc. 0000 0000 0100 Description: The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set. Words: 1 Cycles: 1 Example: CLRWDT ffff Description: FLAG_REG 0x00 1 CLRWDT Status Affected: Z 0000 = = THERE address (HERE) Encoding: 0000 Description: W Z Before Instruction PC = TOS = Encoding: After Instruction Words: PC = Status Affected: Z Before Instruction WDT counter = ? After Instruction WDT counter WDT prescale TO PD = = = = 0x00 0 1 1 DS40139D-page 43 PIC12C5XX COMF Complement f Syntax: [ label ] COMF DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0 f 31 d [0,1] Operands: 0 f 31 d [0,1] Operation: (f) (dest) Operation: (f) - 1 d; f,d Status Affected: Z Encoding: 0010 01df ffff Description: The contents of register 'f' are complemented. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Example: COMF = 0x13 After Instruction REG1 W = = Encoding: Decrement f Syntax: [ label ] DECF f,d Operands: 0 f 31 d [0,1] Operation: (f) - 1 (dest) Description: 0000 1 Cycles: 1(2) Example: HERE 1 Cycles: 1 Example: DECF Before Instruction CNT Z = = = = CNT, 1 LOOP PC = address (HERE) After Instruction CNT if CNT PC if CNT PC 11df CNT, = = = = CNT - 1; 0, address (CONTINUE); 0, address (HERE+1) ffff GOTO Unconditional Branch Syntax: [ label ] Operands: 0 k 511 Operation: k PC<8:0>; STATUS<6:5> PC<10:9> 1 GOTO k Status Affected: None 0x01 0 After Instruction CNT Z DECFSZ GOTO CONTINUE * * * Before Instruction Decrement register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: ffff Words: Status Affected: Z Encoding: 11df The contents of register 'f' are decremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction. 0x13 0xEC DECF 0010 Description: REG1,0 Before Instruction REG1 skip if result = 0 Status Affected: None Encoding: 101k kkkk kkkk Description: GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a two cycle instruction. Words: 1 Cycles: 2 Example: GOTO THERE 0x00 1 After Instruction PC = DS40139D-page 44 address (THERE) 1998 Microchip Technology Inc. PIC12C5XX INCF Increment f IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 f 31 d [0,1] Operands: 0 k 255 Operation: (f) + 1 (dest) (W) .OR. (k) (W) Operation: INCF f,d Status Affected: Z Status Affected: Z Encoding: Description: Encoding: 0010 10df ffff 1 Cycles: 1 Example: INCF CNT, = = kkkk kkkk The contents of the W register are OR'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Cycles: 1 Example: IORLW 0x35 Before Instruction 1 W Before Instruction CNT Z 1101 Description: The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: IORLW k = 0x9A After Instruction 0xFF 0 W Z = = 0xBF 0 After Instruction CNT Z = = 0x00 1 IORWF Inclusive OR W with f Syntax: [ label ] Operands: 0 f 31 d [0,1] (W).OR. (f) (dest) INCFSZ Increment f, Skip if 0 Syntax: [ label ] Operands: 0 f 31 d [0,1] Operation: (f) + 1 (dest), skip if result = 0 Encoding: Operation: INCFSZ f,d Description: 0011 f,d Status Affected: Z Status Affected: None Encoding: IORWF 11df 00df ffff Description: Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: 1 Cycles: 1 Example: IORWF ffff The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, then the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction. 0001 RESULT, 0 Before Instruction RESULT = W = 0x13 0x91 After Instruction Words: 1 Cycles: 1(2) Example: HERE INCFSZ GOTO CONTINUE * * * CNT, LOOP 1 RESULT = W = Z = 0x13 0x93 0 Before Instruction PC = address (HERE) After Instruction CNT if CNT PC if CNT PC = = = = CNT + 1; 0, address (CONTINUE); 0, address (HERE +1) 1998 Microchip Technology Inc. DS40139D-page 45 PIC12C5XX MOVF Move f Syntax: [ label ] Operands: 0 f 31 d [0,1] Operation: (f) (dest) MOVF f,d 0010 Description: Move W to f Syntax: [ label ] Operands: 0 f 31 Operation: (W) (f) Encoding: 00df ffff The contents of register 'f' is moved to destination 'd'. If 'd' is 0, destination is the W register. If 'd' is 1, the destination is file register 'f'. 'd' is 1 is useful to test a file register since status flag Z is affected. 1 Cycles: 1 Example: MOVF 0000 001f Move data from the W register to register 'f'. Words: 1 Cycles: 1 Example: MOVWF TEMP_REG W TEMP_REG FSR, = = 0xFF 0x4F = = 0x4F 0x4F After Instruction 0 TEMP_REG W value in FSR register NOP No Operation MOVLW Move Literal to W Syntax: [ label ] NOP Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: No operation Operation: k (W) Status Affected: None MOVLW k Status Affected: None Encoding: 0000 0000 Description: No operation. The eight bit literal 'k' is loaded into the W register. The don't cares will assemble as 0s. Words: 1 Cycles: 1 Words: 1 Example: NOP Cycles: 1 Example: MOVLW Encoding: 1100 Description: ffff Description: After Instruction = f Before Instruction Words: W MOVWF Status Affected: None Status Affected: Z Encoding: MOVWF kkkk kkkk 0000 0x5A After Instruction W = DS40139D-page 46 0x5A 1998 Microchip Technology Inc. PIC12C5XX OPTION Load OPTION Register RLF Rotate Left f through Carry Syntax: [ label ] Syntax: [ label ] RLF Operands: None Operands: Operation: (W) OPTION 0 f 31 d [0,1] Operation: See description below OPTION Status Affected: None Encoding: 0000 0000 0010 Description: The content of the W register is loaded into the OPTION register. Words: 1 Cycles: 1 Example Status Affected: C Encoding: Description: OPTION 0011 = After Instruction 0x07 RETLW Return with Literal in W Syntax: [ label ] Operands: 0 k 255 Operation: k (W); TOS PC Words: 1 Cycles: 1 Example: RLF 1000 Description: kkkk REG1 C REG1 W C 1 Cycles: 2 Example: CALL TABLE ;W contains ;table offset ;value. * ;W now has table * ;value. * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ; End of table W = 0x07 After Instruction W = value of k8 1110 0110 0 = = = 1110 0110 1100 1100 1 kkkk Words: Before Instruction = = After Instruction The W register is loaded with the eight bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two cycle instruction. TABLE REG1,0 Before Instruction RETLW k Status Affected: None Encoding: ffff register 'f' C 0x07 OPTION = 01df The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is stored back in register 'f'. Before Instruction W f,d RRF Rotate Right f through Carry Syntax: [ label ] Operands: 0 f 31 d [0,1] Operation: See description below RRF f,d Status Affected: C Encoding: Description: 0011 00df ffff The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. C Words: 1 Cycles: 1 Example: RRF register 'f' REG1,0 Before Instruction REG1 C = = 1110 0110 0 After Instruction REG1 W C 1998 Microchip Technology Inc. = = = 1110 0110 0111 0011 0 DS40139D-page 47 PIC12C5XX SLEEP Enter SLEEP Mode SUBWF Subtract W from f Syntax: [label] Syntax: [label] Operands: None Operands: Operation: 00h WDT; 0 WDT prescaler; 1 TO; 0 PD 0 f 31 d [0,1] Operation: (f) - (W) (dest) SLEEP Status Affected: TO, PD, GPWUF Encoding: Description: 0000 0000 Words: 1 Cycles: 1 Example: SLEEP Status Affected: C, DC, Z Encoding: 0000 10df ffff Description: Subtract (2's complement method) the W register from register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Example 1: SUBWF 0011 Time-out status bit (TO) is set. The power down status bit (PD) is cleared. GPWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See section on SLEEP for more details. SUBWF f,d REG1, 1 Before Instruction REG1 W C = = = 3 2 ? After Instruction REG1 W C = = = 1 2 1 ; result is positive Example 2: Before Instruction REG1 W C = = = 2 2 ? After Instruction REG1 W C = = = 0 2 1 ; result is zero Example 3: Before Instruction REG1 W C = = = 1 2 ? After Instruction REG1 W C DS40139D-page 48 = = = FF 2 0 ; result is negative 1998 Microchip Technology Inc. PIC12C5XX SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W Syntax: [ label ] SWAPF f,d Syntax: [label] Operands: 0 f 31 d [0,1] Operands: 0 k 255 (f<3:0>) (dest<7:4>); (f<7:4>) (dest<3:0>) Operation: (W) .XOR. k (W) Status Affected: Z Operation: Encoding: Status Affected: None XORLW k 1111 kkkk kkkk Description: The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0 the result is placed in W register. If 'd' is 1 the result is placed in register 'f'. The contents of the W register are XOR'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Cycles: 1 Words: 1 Example: XORLW Cycles: 1 Example SWAPF Encoding: 0011 Description: 10df ffff REG1, W 0 = = 0xB5 After Instruction Before Instruction REG1 0xAF Before Instruction W 0xA5 = 0x1A After Instruction REG1 W = = 0xA5 0X5A XORWF Exclusive OR W with f Syntax: [ label ] XORWF Operands: 0 f 31 d [0,1] Operation: (W) .XOR. (f) (dest) TRIS Load TRIS Register Syntax: [ label ] TRIS Operands: f=6 Status Affected: Z Operation: (W) TRIS register f Encoding: f Status Affected: None Encoding: 0000 0000 TRIS register 'f' (f = 6) is loaded with the contents of the W register Words: 1 Cycles: 1 Example TRIS GPIO Before Instruction W = Note: = ffff Exclusive OR the contents of the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Example XORWF REG,1 Before Instruction 0XA5 After Instruction TRIS 10df Description: 0fff Description: 0001 f,d 0XA5 f = 6 for PIC12C5XX only. 1998 Microchip Technology Inc. REG W = = 0xAF 0xB5 After Instruction REG W = = 0x1A 0xB5 DS40139D-page 49 PIC12C5XX NOTES: DS40139D-page 50 1998 Microchip Technology Inc. PIC12C5XX 9.0 DEVELOPMENT SUPPORT 9.1 Development Tools The PICmicr microcontrollers are supported with a full range of hardware and software development tools: * MPLABTM-ICE Real-Time In-Circuit Emulator * ICEPIC Low-Cost PIC16C5X and PIC16CXXX In-Circuit Emulator * PRO MATE II Universal Programmer * PICSTART Plus Entry-Level Prototype Programmer * SIMICE * PICDEM-1 Low-Cost Demonstration Board * PICDEM-2 Low-Cost Demonstration Board * PICDEM-3 Low-Cost Demonstration Board * MPASM Assembler * MPLAB SIM Software Simulator * MPLAB-C17 (C Compiler) * Fuzzy Logic Development System (fuzzyTECH-MP) * KEELOQ(R) Evaluation Kits and Programmer 9.2 MPLAB-ICE: High Performance Universal In-Circuit Emulator with MPLAB IDE The MPLAB-ICE Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers (MCUs). MPLAB-ICE is supplied with the MPLAB Integrated Development Environment (IDE), which allows editing, "make" and download, and source debugging from a single environment. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB-ICE allows expansion to support all new Microchip microcontrollers. The MPLAB-ICE Emulator System has been designed as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows 3.x or Windows 95 environment were chosen to best make these features available to you, the end user. 9.3 ICEPIC: Low-Cost PICmicroTM In-Circuit Emulator ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC12CXXX, PIC16C5X and PIC16CXXX families of 8-bit OTP microcontrollers. ICEPIC is designed to operate on PC-compatible machines ranging from 386 through Pentium based machines under Windows 3.x, Windows 95, or Windows NT environment. ICEPIC features real time, nonintrusive emulation. 9.4 PRO MATE II: Universal Programmer The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone mode as well as PC-hosted mode. PRO MATE II is CE compliant. The PRO MATE II has programmable VDD and VPP supplies which allows it to verify programmed memory at VDD min and VDD max for maximum reliability. It has an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices. It can also set configuration and code-protect bits in this mode. 9.5 PICSTART Plus Entry Level Development System The PICSTART programmer is an easy-to-use, lowcost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. PICSTART Plus is not recommended for production programming. PICSTART Plus supports all PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices with up to 40 pins. Larger pin count devices such as the PIC16C923, PIC16C924 and PIC17C756 may be supported with an adapter socket. PICSTART Plus is CE compliant. MPLAB-ICE is available in two versions. MPLAB-ICE 1000 is a basic, low-cost emulator system with simple trace capabilities. It shares processor modules with the MPLAB-ICE 2000. This is a full-featured emulator system with enhanced trace, trigger, and data monitoring features. Both systems will operate across the entire operating speed reange of the PICmicro MCU. 1998 Microchip Technology Inc. DS40139D-page 51 PIC12C5XX 9.6 SIMICE Entry-Level Hardware Simulator 9.8 PICDEM-2 Low-Cost PIC16CXX Demonstration Board SIMICE is an entry-level hardware development system designed to operate in a PC-based environment with Microchip's simulator MPLABTM-SIM. Both SIMICE and MPLAB-SIM run under Microchip Technology's MPLAB Integrated Development Environment (IDE) software. Specifically, SIMICE provides hardware simulation for Microchip's PIC12C5XX, PIC12CE5XX, and PIC16C5X families of PICmicroTM 8-bit microcontrollers. SIMICE works in conjunction with MPLAB-SIM to provide non-real-time I/O port emulation. SIMICE enables a developer to run simulator code for driving the target system. In addition, the target system can provide input to the simulator code. This capability allows for simple and interactive debugging without having to manually generate MPLAB-SIM stimulus files. SIMICE is a valuable debugging tool for entrylevel system development. The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-Plus, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-2 board to test firmware. Additional prototype area has been provided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate usage of the I2C bus and separate headers for connection to an LCD module and a keypad. 9.7 9.9 PICDEM-1 Low-Cost PICmicro Demonstration Board The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchip's microcontrollers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-Plus programmer, and easily test firmware. The user can also connect the PICDEM-1 board to the MPLAB-ICE emulator and download the firmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB. DS40139D-page 52 PICDEM-3 Low-Cost PIC16CXXX Demonstration Board The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-3 board to test firmware. Additional prototype area has been provided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features include an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals. 1998 Microchip Technology Inc. PIC12C5XX 9.10 MPLAB Integrated Development Environment Software The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application which contains: * A full featured editor * Three operating modes - editor - emulator - simulator * A project manager * Customizable tool bar and key mapping * A status bar with project information * Extensive on-line help 9.12 Software Simulator (MPLAB-SIM) The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PICmicro series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/ output radix can be set by the user and the execution can be performed in; single step, execute until break, or in a trace mode. MPLAB-SIM fully supports symbolic debugging using MPLAB-C17 and MPASM. The Software Simulator offers the low cost flexibility to develop and debug code outside of the laboratory environment making it an excellent multi-project software development tool. MPLAB allows you to: 9.13 * Edit your source files (either assembly or `C') * One touch assemble (or compile) and download to PICmicro tools (automatically updates all project information) * Debug using: - source files - absolute listing file The MPLAB-C17 Code Development System is a complete ANSI `C' compiler and integrated development environment for Microchip's PIC17CXXX family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers. The ability to use MPLAB with Microchip's simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools. 9.11 Assembler (MPASM) The MPASM Universal Macro Assembler is a PChosted symbolic assembler. It supports all microcontroller series including the PIC12C5XX, PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX families. MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers. MPASM allows full symbolic debugging from MPLABICE, Microchip's Universal Emulator System. MPASM has the following features to assist in developing software for specific use applications. * Provides translation of Assembler source code to object code for all Microchip microcontrollers. * Macro assembly capability. * Produces all the files (Object, Listing, Symbol, and special) required for symbolic debug with Microchip's emulator systems. * Supports Hex (default), Decimal and Octal source and listing formats. MPLAB-C17 Compiler For easier source level debugging, the compiler provides symbol information that is compatible with the MPLAB IDE memory display. 9.14 Fuzzy Logic Development System (fuzzyTECH-MP) fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version, fuzzyTECH-MP, Edition for implementing more complex systems. Both versions include Microchip's fuzzyLAB demonstration board for hands-on experience with fuzzy logic systems implementation. 9.15 SEEVAL Evaluation and Programming System The SEEVAL SEEPROM Designer's Kit supports all Microchip 2-wire and 3-wire Serial EEPROMs. The kit includes everything necessary to read, write, erase or program special features of any Microchip SEEPROM product including Smart Serials and secure serials. The Total Endurance Disk is included to aid in tradeoff analysis and reliability calculations. The total kit can significantly reduce time-to-market and result in an optimized system. MPASM provides a rich directive language to support programming of the PICmicro. Directives are helpful in making the development of your assemble source code shorter and more maintainable. 1998 Microchip Technology Inc. DS40139D-page 53 PIC12C5XX 9.16 KEELOQ Evaluation and Programming Tools KEELOQ evaluation and programming tools support Microchips HCS Secure Data Products. The HCS evaluation kit includes an LCD display to show changing codes, a decoder to decode transmissions, and a programming interface to program test transmitters. DS40139D-page 54 1998 Microchip Technology Inc. Emulator Products u u ICEPIC Low-Cost In-Circuit Emulator MPLAB Integrated Development Environment u u PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C7XX u u u u u u u u u u u u u u u u u u MPLAB C17* Compiler fuzzyTECH-MP Explorer/Edition Fuzzy Logic Dev. Tool u u u u u u u u u u u u u u Programmers u PICSTARTPlus Low-Cost Universal Dev. Kit u u u u u u u u u u PRO MATE II Universal Programmer u u u u u u u u u u u KEELOQ Programmer PICDEM-1 DS40139D-page 55 PICDEM-2 PICDEM-3 u u u u u u u u u u u KEELOQ(R) Evaluation Kit u KEELOQ Transponder Kit u PIC12C5XX SIMICE u u SEEVAL Designers Kit PICDEM-14A HCS200 HCS300 HCS301 u Total Endurance Software Model Demo Boards 24CXX 25CXX 93CXX DEVELOPMENT TOOLS FROM MICROCHIP Software Tools PIC14000 TABLE 9-1: 1998 Microchip Technology Inc. MPLABTM-ICE PIC12C5XX PIC12C5XX NOTES: DS40139D-page 56 1998 Microchip Technology Inc. PIC12C5XX 10.0 ELECTRICAL CHARACTERISTICS - PIC12C508/PIC12C509/ PIC12LC508/PIC12LC509 Absolute Maximum Ratings Ambient Temperature under bias ........................................................................................................... -40C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS .................................................................................................................0 to +7.5 V Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V Voltage on all other pins with respect to VSS ................................................................................-0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ....................................................................................................................................700 mW Max. Current out of VSS pin...................................................................................................................................200 mA Max. Current into VDD pin......................................................................................................................................150 mA Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................25 mA Max. Output Current sourced by I/O port (GPIO)..................................................................................................100 mA Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 1998 Microchip Technology Inc. DS40139D-page 57 PIC12C5XX 10.1 DC CHARACTERISTICS: Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) DC Characteristics Power Supply Pins Characteristic Supply Voltage PIC12C508/509 (Commercial, Industrial, Extended) Sym Min VDD Typ(1) Max Units Conditions 2.5 5.5 V 3.0 5.5 V FOSC = DC to 4 MHz (Commercial/ Industrial) FOSC = DC to 4 MHz (Extended) RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP mode VDD Start Voltage to ensure Power-on Reset VPOR VSS V See section on Power-on Reset for details VDD Rise Rate to ensure Power-on Reset SVDD 0.05* V/ms See section on Power-on Reset for details IDD -- 1.8 2.4 mA -- 1.8 2.4 mA -- 15 27 A -- 19 35 A -- 19 35 A IWDT -- -- -- 3.75 3.75 3.75 8 9 4 A A A XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabledVDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended IPD -- -- -- 0.25 0.25 2 4 5 18 A A A VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended Supply Current(3) Power-Down Current (5) * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. DS40139D-page 58 1998 Microchip Technology Inc. PIC12C5XX 10.2 DC CHARACTERISTICS: DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer PIC12C508/509 (Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS - 0.5V 0.2VDD 0.2VDD V V V VSS - 0.3VDD V Note1 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 VDD VDD VDD VDD VDD VDD 400 V V V V V V A 4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range - - +1 VIH D060 with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL D061 MCLR, GP2/T0CKI - - D063 OSC1 - - +5(5) +5 D080 Output Low Voltage I/O ports/CLKOUT - - 0.6 D080A D083 D083A Note 1: 2: 3: 4: 5: VOL Note1 VDD = 5V, VPIN = VSS A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. 1998 Microchip Technology Inc. V DS40139D-page 59 PIC12C5XX DC CHARACTERISTICS Param No. Characteristic Output High Voltage I/O ports/CLKOUT (Note 3) D090 Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VOH D090A D092 OSC2 D092A Capacitive Loading Specs on Output Pins OSC2 pin D100 D101 Note 1: 2: 3: 4: 5: COSC2 VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V - - 15 pF IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. DS40139D-page 60 1998 Microchip Technology Inc. PIC12C5XX 10.3 DC CHARACTERISTICS: Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) DC Characteristics Power Supply Pins Characteristic Supply Voltage PIC12LC508/509 (Commercial, Industrial) Sym Min VDD Typ(1) Max Units Conditions 2.5 5.5 V 3.0 5.5 V FOSC = DC to 4 MHz (Commercial/ Industrial) FOSC = DC to 4 MHz (Extended) RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP mode VDD Start Voltage to ensure Power-on Reset VPOR VSS V See section on Power-on Reset for details VDD Rise Rate to ensure Power-on Reset SVDD 0.05* V/ms See section on Power-on Reset for details IDD -- 1.8 2.4 mA -- 1.8 2.4 mA -- 15 27 A -- 19 35 A -- 19 35 A IWDT -- -- -- 3.75 3.75 3.75 8 9 4 A A A XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabledVDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended IPD -- -- -- 0.25 0.25 2 4 5 18 A A A VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended Supply Current(3) Power-Down Current (5) * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 1998 Microchip Technology Inc. DS40139D-page 61 PIC12C5XX 10.4 DC CHARACTERISTICS: DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer PIC12LC508/509 (Commercial, Industrial) Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS - 0.5V 0.2VDD 0.2VDD V V V VSS - 0.3VDD V Note1 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 VDD VDD VDD VDD VDD VDD 400 V V V V V V A 4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range - - +1 VIH D060 with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL D061 MCLR, GP2/T0CKI - - D063 OSC1 - - +5(5) +5 D080 Output Low Voltage I/O ports/CLKOUT - - 0.6 D080A D083 D083A Note 1: 2: 3: 4: 5: VOL Note1 VDD = 5V, VPIN = VSS A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. DS40139D-page 62 V 1998 Microchip Technology Inc. PIC12C5XX DC CHARACTERISTICS Param No. Characteristic Output High Voltage I/O ports/CLKOUT (Note 3) D090 Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VOH D090A D092 OSC2 D092A Capacitive Loading Specs on Output Pins OSC2 pin D100 D101 Note 1: 2: 3: 4: 5: COSC2 VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V - - 15 pF IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. 1998 Microchip Technology Inc. DS40139D-page 63 PIC12C5XX TABLE 10-1: PULL-UP RESISTOR RANGES - PIC12C508/C509 VDD (Volts) Temperature (C) Min 2.5 -40 25 85 125 -40 25 85 125 38K 42K 42K 50K 15K 18K 19K 22K -40 25 85 125 -40 25 85 125 285K 343K 368K 431K 247K 288K 306K 351K Typ Max Units 42K 48K 49K 55K 17K 20K 22K 24K 63K 63K 63K 63K 20K 23K 25K 28K 346K 414K 457K 504K 292K 341K 371K 407K 417K 532K 532K 593K 360K 437K 448K 500K GP0/GP1 5.5 GP3 2.5 5.5 * These parameters are characterized but not tested. DS40139D-page 64 1998 Microchip Technology Inc. PIC12C5XX 10.5 Timing Parameter Symbology and Load Conditions - PIC12C508/C509 The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time to mc MCLR Lowercase subscripts (pp) and their meanings: pp 2 ck CLKOUT osc oscillator cy cycle time os OSC1 drt device reset timer t0 T0CKI io I/O port wdt watchdog timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (Hi-impedance) V Valid L Low Z Hi-impedance FIGURE 10-1: LOAD CONDITIONS - PIC12C508/C509 Pin CL = 50 pF for all pins except OSC2 CL VSS 1998 Microchip Technology Inc. 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1 DS40139D-page 65 PIC12C5XX 10.6 Timing Diagrams and Specifications FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC12C508/C509 Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 3 3 4 4 2 TABLE 10-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508/C509 AC Characteristics Parameter No. Sym FOSC Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Characteristic TOSC Tcy Max DC -- 4 DC -- 200 0.1 -- 4 Units Conditions MHz XT osc mode kHz LP osc mode (2) External CLKIN Period (2) Oscillator Period(2) 2 Typ(1) External CLKIN Frequency(2) Oscillator Frequency 1 Min Instruction Cycle Time(3) MHz XT osc mode DC -- 200 kHz 250 -- -- ns EXTRC osc mode LP osc mode 250 -- -- ns XT osc mode 5 -- -- ms LP osc mode 250 -- -- ns EXTRC osc mode 250 -- 10,000 ns XT osc mode 5 -- -- ms LP osc mode -- 4/FOSC -- -- -- ns XT oscillator 3 TosL, TosH Clock in (OSC1) Low or High Time 50* -- 2* -- -- ms LP oscillator 4 TosR, TosF Clock in (OSC1) Rise or Fall Time -- -- 25* ns XT oscillator -- -- 50* ns LP oscillator * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period. DS40139D-page 66 1998 Microchip Technology Inc. PIC12C5XX TABLE 10-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508/C509 AC Characteristics Parameter No. Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Min* Typ(1) Max* Units Internal Calibrated RC Frequency 3.64 4.00 4.32 MHz VDD = 5.0V Internal Calibrated RC Frequency 3.51 4.00 4.26 MHz VDD = 2.5V Sym Characteristic Conditions * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 10-3: I/O TIMING - PIC12C508/C509 Q1 Q4 Q2 Q3 OSC1 I/O Pin (input) 17 I/O Pin (output) 19 18 New Value Old Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT. 1998 Microchip Technology Inc. DS40139D-page 67 PIC12C5XX TABLE 10-4: TIMING REQUIREMENTS - PIC12C508/C509 AC Characteristics Parameter No. Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Sym Characteristic Min Typ(1) Max Units 17 TosH2ioV OSC1 (Q1 cycle) to Port out valid(3) -- -- 100* ns 18 TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TBD -- -- ns 19 TioV2osH Port input valid to OSC1 (I/O in setup time) TBD -- -- ns 20 TioR Port output rise time(3) -- 10 25** ns 21 TioF Port output fall time(3) -- 10 25** ns * These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 10-1 for loading conditions. FIGURE 10-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC12C508/C509 VDD MCLR 30 Internal POR 32 32 32 DRT Timeout (Note 2) Internal RESET Watchdog Timer RESET 31 34 34 I/O pin (Note 1) Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT reset only in XT and LP modes. DS40139D-page 68 1998 Microchip Technology Inc. PIC12C5XX TABLE 10-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508/C509 AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Parameter No. Sym Characteristic 30 TmcL MCLR Pulse Width (low) 31 Twdt 32 34 Min Typ(1) Max Units 2000* -- -- ns VDD = 5 V Watchdog Timer Time-out Period (No Prescaler) 9* 18* 30* ms VDD = 5 V (Commercial) TDRT Device Reset Timer Period(2) 9* 18* 30* ms VDD = 5 V (Commercial) TioZ I/O Hi-impedance from MCLR Low -- -- 2000* ns Conditions * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 10-6: DRT (DEVICE RESET TIMER PERIOD - PIC12C508/C509) Oscillator Configuration POR Reset Subsequent Resets IntRC & ExtRC 18 ms (typical) 300 s (typical) XT & LP 18 ms (typical) 18 ms (typical) 1998 Microchip Technology Inc. DS40139D-page 69 PIC12C5XX FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC12C508/C509 T0CKI 40 41 42 TABLE 10-7: TIMER0 CLOCK REQUIREMENTS - PIC12C508/C509 AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1. Parameter Sym Characteristic No. 40 Min Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period Typ(1) Max Units Conditions 0.5 TCY + 20* -- -- ns 10* -- -- ns 0.5 TCY + 20* -- -- ns 10* -- -- ns 20 or TCY + 40* N -- -- ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40139D-page 70 1998 Microchip Technology Inc. PIC12C5XX NOTES: 1998 Microchip Technology Inc. DS40139D-page 71 PIC12C5XX DS40139D-page 72 1998 Microchip Technology Inc. PIC12C5XX 11.0 DC AND AC CHARACTERISTICS - PIC12C508/PIC12C509/ PIC12LC508/PIC12LC509 The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation. FIGURE 11-1: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 2.5V) Calibrated Internal RC Frequency Range vs Temperature (Vdd=2.5V) 4.45 4.25 Frequency (Mhz) 4.05 3.85 3.65 3.45 3.25 -40 25 85 125 Temperature (Deg C) 1998 Microchip Technology Inc. DS40139D-page 73 PIC12C5XX FIGURE 11-2: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 5.0V) Calibrated Internal RC Frequency Range vs Temperature (Vdd=5.0V) FIGURE 11-3: WDT TIMER TIME-OUT PERIOD vs. VDD 50 45 Frequency (Mhz) 40 WDT period (mS) 35 30 Max +125C 25 Max +85C 20 25 Typ +25C 85 Temperature (Deg C) 15 10 TABLE 11-1: Oscillator DYNAMIC IDD (TYPICAL) WDT ENABLED, 25C Frequency VDD = 2.5V External RC 4 MHz 250 A* Internal RC 4 MHz 420 A XT 4 MHz 251 A LP 32 KHz 7 A *Does not include current through external R&C. DS40139D-page 74 MIn -40C 5 2 VDD = 5.5V 620 A* 1.1 mA 775 A 37 A 3 4 5 VDD (Volts) 6 7 1998 Microchip Technology Inc. PIC12C5XX FIGURE 11-4: SHORT DRT PERIOD VS. VDD FIGURE 11-6: IOH vs. VOH, VDD = 5.5 V 1000 0 900 -5 800 -10 IOH (mA) 600 500 -15 Max +125C 25 -20 Max +85C in M C -25 M ax -4 Typ +25C 0 300 Ty p +2 5 C M in +8 400 C +1 5 C WDT period (s) 700 200 -30 3.5 MIn -40C 100 2 3 4 5 VDD (Volts) 6 4.0 4.5 5.0 5.5 VOH (Volts) 7 FIGURE 11-7: IOL vs. VOL, VDD = 2.5 V FIGURE 11-5: IOH vs. VOH, VDD = 2.5 V 25 0 -1 20 Max -40C -2 IOL (mA) IOH (mA) 15 -3 -4 Typ +25C 10 Min C +125 -5 Min +85C 85C Min + Min +125C 5 -6 Typ +25C Max -40C -7 500m 1.0 1.5 VOH (Volts) 2.0 2.5 0 0 250.0m 500.0m 1.0 VOL (Volts) 1998 Microchip Technology Inc. DS40139D-page 75 PIC12C5XX FIGURE 11-8: IOL vs. VOL, VDD = 5.5 V 50 Max -40C 40 30 IOL (mA) Typ +25C Min +85C 20 Min +125C 10 0 250.0m 500.0m 750.0m 1.0 VOL (Volts) NOTES: DS40139D-page 76 1998 Microchip Technology Inc. PIC12C5XX 12.0 ELECTRICAL CHARACTERISTICS - PIC12C508A/PIC12C509A/ PIC12LC508A/PIC12LC509A Absolute Maximum Ratings Ambient Temperature under bias ........................................................................................................... -40C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS .................................................................................................................0 to +7.0 V Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V Voltage on all other pins with respect to VSS ................................................................................-0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ....................................................................................................................................700 mW Max. Current out of VSS pin...................................................................................................................................200 mA Max. Current into VDD pin......................................................................................................................................150 mA Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................25 mA Max. Output Current sourced by I/O port (GPIO)..................................................................................................100 mA Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 1998 Microchip Technology Inc. Preliminary DS40139D-page 77 PIC12C5XX 12.1 DC CHARACTERISTICS: Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) DC Characteristics Power Supply Pins Characteristic PIC12C508A/509A (Commercial) PIC12C508A/509A (Industrial) PIC12C508A/509A (Extended) Typ(1) Sym Min Supply Voltage VDD 3.0 RAM Data Retention Voltage(2) VDR VDD Start Voltage to ensure Power-on Reset VPOR VDD Rise Rate to ensure Power-on Reset SVDD 0.05* IDD -- 0.6 -- Supply Current(3) Power-Down Current (5) Max Units Conditions 5.5 V FOSC = DC to 4 MHz (Commercial/ Industrial, Extended) 1.5* V Device in SLEEP mode VSS V See section on Power-on Reset for details V/ms See section on Power-on Reset for details 1.4 mA 0.6 1.4 mA -- 15 27 A -- 19 35 A -- 19 35 A IWDT -- -- -- 3.75 3.75 3.75 8 9 4 A A A XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended IPD -- -- -- 0.25 0.25 2 4 5 18 A A A VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. DS40139D-page 78 Preliminary 1998 Microchip Technology Inc. PIC12C5XX 12.2 DC CHARACTERISTICS: Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) DC Characteristics Power Supply Pins Characteristic PIC12LC508A/509A (Commercial, Industrial) Typ(1) Sym Min Supply Voltage VDD 2.5 RAM Data Retention Voltage(2) VDR VDD Start Voltage to ensure Power-on Reset VPOR VDD Rise Rate to ensure Power-on Reset SVDD 0.05* IDD -- TBD -- Supply Current(3) IWDT Power-Down Current (5) Max Units Conditions 5.5 V FOSC = DC to 4 MHz (Commercial/ Industrial) 1.5* V Device in SLEEP mode VSS V See section on Power-on Reset for details V/ms See section on Power-on Reset for details TBD mA TBD TBD mA -- TBD TBD A -- TBD TBD A XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 2.5V INTRC Option FOSC = 4 MHz, VDD = 2.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 2.5V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 2.5V, WDT disabled -- TBD TBD A -- -- TBD TBD TBD TBD A A IPD VDD = 2.5V, Commercial VDD = 2.5V, Industrial * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 1998 Microchip Technology Inc. Preliminary DS40139D-page 79 PIC12C5XX 12.3 DC CHARACTERISTICS: DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer PIC12C508A/509A (Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS - 0.5V 0.2VDD 0.2VDD V V V VSS - 0.3VDD V Note1 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 VDD VDD VDD VDD VDD VDD 400 V V V V V V A 4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range - - +1 VIH D060 with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL D061 MCLR, GP2/T0CKI - - D063 OSC1 - - +5(5) +5 D080 Output Low Voltage I/O ports/CLKOUT - - 0.6 D080A D083 D083A Note 1: 2: 3: 4: 5: VOL Note1 VDD = 5V, VPIN = VSS A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. DS40139D-page 80 Preliminary V 1998 Microchip Technology Inc. PIC12C5XX DC CHARACTERISTICS Param No. Characteristic Output High Voltage I/O ports/CLKOUT (Note 3) D090 Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VOH D090A D092 OSC2 D092A Capacitive Loading Specs on Output Pins OSC2 pin D100 D101 Note 1: 2: 3: 4: 5: COSC2 VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V - - 15 pF IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. 1998 Microchip Technology Inc. Preliminary DS40139D-page 81 PIC12C5XX 12.4 DC CHARACTERISTICS: DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer PIC12LC508A/509A (Commercial, Industrial) Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VIL D060 D061 D063 MCLR, GP2/T0CKI OSC1 D080 Output Low Voltage I/O ports/CLKOUT D083 D083A Note 1: 2: 3: 4: 5: - 0.5V 0.2VDD 0.2VDD V V V VSS - 0.3VDD V Note1 TBD TBD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 VDD VDD VDD VDD VDD VDD 400 V V V V V V A 4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range TBD TBD TBD TBD TBD TBD TBD TBD TBD A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration - - TBD VIH with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL D080A VSS VSS VSS VOL Note1 VDD = 5V, VPIN = VSS IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C67X be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. DS40139D-page 82 Preliminary V 1998 Microchip Technology Inc. PIC12C5XX DC CHARACTERISTICS Param No. Characteristic Output High Voltage I/O ports/CLKOUT (Note 3) D090 Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VOH D090A D092 OSC2 D092A Capacitive Loading Specs on Output Pins OSC2 pin D100 D101 Note 1: 2: 3: 4: 5: COSC2 VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V - - 15 pF IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C67X be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up. 1998 Microchip Technology Inc. Preliminary DS40139D-page 83 PIC12C5XX TABLE 12-1: PULL-UP RESISTOR RANGES - PIC12C508A/C509A VDD (Volts) Temperature (C) Min 2.5 -40 25 85 125 -40 25 85 125 38K 42K 42K 50K 15K 18K 19K 22K -40 25 85 125 -40 25 85 125 285K 343K 368K 431K 247K 288K 306K 351K Typ Max Units 42K 48K 49K 55K 17K 20K 22K 24K 63K 63K 63K 63K 20K 23K 25K 28K 346K 414K 457K 504K 292K 341K 371K 407K 417K 532K 532K 593K 360K 437K 448K 500K GP0/GP1 5.5 GP3 2.5 5.5 * These parameters are characterized but not tested. DS40139D-page 84 Preliminary 1998 Microchip Technology Inc. PIC12C5XX 12.5 Timing Parameter Symbology and Load Conditions - PIC12C508A/C509A The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time to mc MCLR Lowercase subscripts (pp) and their meanings: pp 2 ck CLKOUT osc oscillator cy cycle time os OSC1 drt device reset timer t0 T0CKI io I/O port wdt watchdog timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (Hi-impedance) V Valid L Low Z Hi-impedance FIGURE 12-1: LOAD CONDITIONS - PIC12C508A/C509A Pin CL = 50 pF for all pins except OSC2 CL VSS 1998 Microchip Technology Inc. 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1 Preliminary DS40139D-page 85 PIC12C5XX 12.6 Timing Diagrams and Specifications FIGURE 12-2: EXTERNAL CLOCK TIMING - PIC12C508A/C509A Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 3 3 4 4 2 TABLE 12-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508A/C509A AC Characteristics Parameter No. Sym FOSC Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Characteristic TOSC (2) Tcy Max DC -- 4 DC -- 200 DC -- 4 MHz EXTRC osc mode 0.1 -- 4 MHz XT osc mode DC -- 200 250 -- -- ns XT osc mode 5 -- -- ms LP osc mode 250 -- -- ns EXTRC osc mode 250 -- 10,000 ns XT osc mode 5 -- -- ms LP osc mode -- 4/FOSC -- -- -- ns XT oscillator Units Conditions External CLKIN Period MHz XT osc mode kHz kHz LP osc mode LP osc mode (2) Oscillator Period(2) 2 Typ(1) External CLKIN Frequency(2) Oscillator Frequency 1 Min Instruction Cycle Time(3) 3 TosL, TosH Clock in (OSC1) Low or High Time 50* -- 2* -- -- ms LP oscillator 4 TosR, TosF Clock in (OSC1) Rise or Fall Time -- -- 25* ns XT oscillator -- -- 50* ns LP oscillator * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period. DS40139D-page 86 Preliminary 1998 Microchip Technology Inc. PIC12C5XX TABLE 12-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508A/C509A AC Characteristics Parameter No. Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Min* Typ(1) Max* Units Internal Calibrated RC Frequency TBD 4.00 TBD MHz VDD = 5.0V Internal Calibrated RC Frequency TBD 4.00 TBD MHz VDD = 2.5V Sym Characteristic Conditions * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1998 Microchip Technology Inc. Preliminary DS40139D-page 87 PIC12C5XX FIGURE 12-3: I/O TIMING - PIC12C508A/C509A Q1 Q4 Q2 Q3 OSC1 I/O Pin (input) 17 I/O Pin (output) 19 18 New Value Old Value 20, 21 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT. TABLE 12-4: TIMING REQUIREMENTS - PIC12C508A/C509A AC Characteristics Parameter No. Sym Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Characteristic Min Typ(1) Max Units 17 TosH2ioV OSC1 (Q1 cycle) to Port out valid(3) -- -- 100* ns 18 TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TBD -- -- ns 19 TioV2osH Port input valid to OSC1 (I/O in setup time) TBD -- -- ns 20 TioR Port output rise time(3) -- 10 25** ns 21 TioF Port output fall time(3) -- 10 25** ns * These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 12-1 for loading conditions. DS40139D-page 88 Preliminary 1998 Microchip Technology Inc. PIC12C5XX FIGURE 12-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING PIC12C508A/C509A VDD MCLR 30 Internal POR 32 32 32 DRT Timeout (Note 2) Internal RESET Watchdog Timer RESET 31 34 34 I/O pin (Note 1) Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT reset only in XT and LP modes. TABLE 12-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508A/C509A AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Parameter No. Sym Characteristic 30 TmcL MCLR Pulse Width (low) 31 Twdt 32 34 Min Typ(1) Max Units 2000* -- -- ns VDD = 5 V Watchdog Timer Time-out Period (No Prescaler) 9* 18* 30* ms VDD = 5 V (Commercial) TDRT Device Reset Timer Period(2) 9* 18* 30* ms VDD = 5 V (Commercial) TioZ I/O Hi-impedance from MCLR Low -- -- 2000* ns Conditions * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1998 Microchip Technology Inc. Preliminary DS40139D-page 89 PIC12C5XX TABLE 12-6: DRT (DEVICE RESET TIMER PERIOD) - PIC12C508A/C509A Oscillator Configuration POR Reset Subsequent Resets IntRC & ExtRC 18 ms (typical) 300 s (typical) XT & LP 18 ms (typical) 18 ms (typical) FIGURE 12-5: TIMER0 CLOCK TIMINGS - PIC12C508A/C509A T0CKI 40 41 42 TABLE 12-7: TIMER0 CLOCK REQUIREMENTS - PIC12C508A/C509A AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1. Parameter Sym Characteristic No. 40 Min Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler 42 Tt0P T0CKI Period - With Prescaler Typ(1) Max Units Conditions 0.5 TCY + 20* -- -- ns 10* -- -- ns 0.5 TCY + 20* -- -- ns 10* -- -- ns 20 or TCY + 40* N -- -- ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40139D-page 90 Preliminary 1998 Microchip Technology Inc. PIC12C5XX 13.0 DC AND AC CHARACTERISTICS - PIC12C508A/PIC12C509A/ PIC12LC508A/PIC12LC509A The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation. FIGURE 13-1: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 5.0V) (INTERNAL RC IS CALIBRATED TO 25C, 5.0V) Not available at this time. FIGURE 13-2: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 2.5V) (INTERNAL RC IS CALIBRATED TO 25C, 5.0V) Not available at this time. 1998 Microchip Technology Inc. Preliminary DS40139D-page 91 PIC12C5XX TABLE 13-1: DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25C Oscillator Frequency VDD =3.0V External RC 4 MHz 300 A* Internal RC 4 MHz 520 A XT 4 MHz 300 A LP 32 KHz 10 A *Does not include current through external R&C. FIGURE 13-3: WDT TIMER TIME-OUT PERIOD vs. VDD VDD = 5.5V 620 A* 1.1 mA 775 A 37 A FIGURE 13-4: SHORT DRT PERIOD VS. VDD 1000 50 900 45 800 40 700 WDT period (s) WDT period (mS) 35 30 25 Max +125C Max +125C Max +85C 300 Typ +25C 15 500 400 Max +85C 20 600 Typ +25C 200 MIn -40C 10 MIn -40C 100 2 5 2 DS40139D-page 92 3 4 5 VDD (Volts) 6 7 Preliminary 3 4 5 VDD (Volts) 6 7 1998 Microchip Technology Inc. PIC12C5XX FIGURE 13-5: IOH vs. VOH, VDD = 2.5 V FIGURE 13-7: IOL vs. VOL, VDD = 2.5 V 35 0 30 -5 TBD TBD 25 IOL (mA) IOH (mA) -10 -15 20 15 -20 10 -25 5 0 -30 1.5 2.0 2.5 3.0 3.5 0 VOH (Volts) 500.0m 750.0m 1.0 VOL (Volts) FIGURE 13-6: IOH vs. VOH, VDD = 3.5 V FIGURE 13-8: IOL vs. VOL, VDD = 3.5 V 0 35 -5 30 5C 25 12 + in M 0 C C 25 p+ -20 Ty x Ma 20 M C C 5 +8 125 in n + M i M 15 0C -4 C -4 C Mi ax +2 5 85 n+ Ty p -15 IOL (mA) IOH (mA) -10 10 -25 5 -30 1.5 2.0 2.5 3.0 3.5 VOH (Volts) 0 0 500.0m 750.0m 1.0 VOL (Volts) 1998 Microchip Technology Inc. Preliminary DS40139D-page 93 PIC12C5XX FIGURE 13-9: IOH vs. VOH, VDD = 5.5 V FIGURE 13-10: IOL vs. VOL, VDD = 5.5 V 50 0 Max -40C -5 40 30 -15 25 in Min +85C 20 C M in +8 M C +1 5 C -20 Typ +25C IOL (mA) IOH (mA) -10 0 10 M ax -4 -25 C Ty p +2 5 Min +125C -30 3.5 4.0 4.5 5.0 5.5 VOH (Volts) 0 250.0m 500.0m 750.0m 1.0 VOL (Volts) DS40139D-page 94 Preliminary 1998 Microchip Technology Inc. PIC12C5XX 14.0 PACKAGING INFORMATION 14.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXCDE AABB 12C508A 04I/PSAZ 9825 8-Lead SOIC (150 mil) XXXXXXX 9825 8-Lead SOIC (208 mil) XXXXXXX XXXXXXX AABBCDE Example 12C508A 04I/SM 9824SAZ 8-Lead Windowed Ceramic Side Brazed (300 mil) Example JW XXX 12C508A XXXXXX Legend: MM...M XX...X AA BB C D E * Example C508A XXXX Note: Example Microchip part number information Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5" Line S = 6" Line H = 8" Line Mask revision number Assembly code of the plant or country of origin in which part was assembled In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 1998 Microchip Technology Inc. DS40139D-page 95 PIC12C5XX Package Type: K04-018 8-Lead Plastic Dual In-line (P) - 300 mil E D 2 1 n E1 A A1 R L c A2 B1 p eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Molded Package Width Radius to Radius Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom B INCHES* NOM 0.300 8 0.100 0.018 0.014 0.060 0.055 0.005 0.000 0.012 0.006 0.150 0.140 0.080 0.060 0.020 0.005 0.130 0.120 0.370 0.355 0.250 0.245 0.280 0.267 0.310 0.342 5 10 5 10 MIN n p B B1 R c A A1 A2 L D E E1 eB MAX 0.022 0.065 0.010 0.015 0.160 0.100 0.035 0.140 0.385 0.260 0.292 0.380 15 15 MILLIMETERS NOM MAX 7.62 8 2.54 0.56 0.36 0.46 1.65 1.40 1.52 0.25 0.00 0.13 0.38 0.20 0.29 4.06 3.56 3.81 2.54 1.52 2.03 0.89 0.13 0.51 3.56 3.05 3.30 9.78 9.02 9.40 6.60 6.22 6.35 7.42 6.78 7.10 7.87 8.67 9.65 5 10 15 5 10 15 MIN * Controlling Parameter. Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E." DS40139D-page 96 1998 Microchip Technology Inc. PIC12C5XX Package Type: K04-057 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil E1 E p D 2 B n 1 X 45 L R2 c A R1 Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Chamfer Distance Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom L1 A2 INCHES* NOM 0.050 8 0.061 0.054 0.035 0.027 0.007 0.004 0.193 0.189 0.154 0.150 0.237 0.229 0.015 0.010 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.005 0.000 0.008 0.009 0.014 0.017 12 0 12 0 MIN p n A A1 A2 D E E1 X R1 R2 L L1 c B A1 MAX 0.069 0.044 0.010 0.196 0.157 0.244 0.020 0.010 0.010 0.021 8 0.010 0.010 0.020 15 15 MILLIMETERS NOM MAX 1.27 8 1.56 1.37 1.75 0.69 0.90 1.11 0.10 0.18 0.25 4.80 4.89 4.98 3.81 3.90 3.99 5.82 6.01 6.20 0.25 0.38 0.51 0.13 0.13 0.25 0.13 0.13 0.25 0.28 0.41 0.53 8 0 4 0.00 0.13 0.25 0.22 0.25 0.19 0.36 0.43 0.51 0 12 15 0 12 15 MIN * Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E." 1998 Microchip Technology Inc. DS40139D-page 97 PIC12C5XX Package Type: K04-056 8-Lead Plastic Small Outline (SM) - Medium, 208 mil E1 E p D 2 n 1 B L R2 c A R1 L1 Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom INCHES* NOM 0.050 8 0.070 0.074 0.037 0.042 0.002 0.005 0.200 0.205 0.203 0.208 0.313 0.300 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.015 0.010 0.008 0.009 0.014 0.017 0 12 12 0 MIN p n A A1 A2 D E E1 R1 R2 L L1 c B A1 A2 MAX 0.079 0.048 0.009 0.210 0.213 0.325 0.010 0.010 0.021 8 0.020 0.010 0.020 15 15 MILLIMETERS NOM MAX 1.27 8 2.00 1.89 1.78 1.21 0.94 1.08 0.22 0.05 0.14 5.08 5.33 5.21 5.16 5.41 5.28 7.62 7.94 8.26 0.13 0.13 0.25 0.13 0.13 0.25 0.28 0.41 0.53 8 0 4 0.25 0.38 0.51 0.19 0.22 0.25 0.36 0.43 0.51 0 12 15 0 12 15 MIN * Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E." DS40139D-page 98 1998 Microchip Technology Inc. PIC12C5XX Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil E W T D 2 n 1 U A A1 L A2 c B1 p eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Lead Thickness Top to Seating Plane Top of Body to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Package Width Overall Row Spacing Window Diameter Lid Length Lid Width B MIN n p B B1 c A A1 A2 L D E eB W T U 0.098 0.016 0.050 0.008 0.145 0.103 0.025 0.130 0.510 0.280 0.310 0.161 0.440 0.260 INCHES* NOM 0.300 8 0.100 0.018 0.055 0.010 0.165 0.123 0.035 0.140 0.520 0.290 0.338 0.166 0.450 0.270 MAX 0.102 0.020 0.060 0.012 0.185 0.143 0.045 0.150 0.530 0.300 0.365 0.171 0.460 0.280 MILLIMETERS NOM MAX 7.62 8 2.54 2.49 2.59 0.41 0.51 0.46 1.27 1.40 1.52 0.20 0.25 0.30 3.68 4.70 4.19 3.12 2.62 3.63 0.89 0.64 1.14 3.56 3.30 3.81 12.95 13.21 13.46 7.11 7.37 7.62 7.87 9.27 8.57 4.09 4.34 4.22 11.18 11.68 11.43 6.60 7.11 6.86 MIN * Controlling Parameter. 1998 Microchip Technology Inc. DS40139D-page 99 PIC12C5XX DS40139D-page 100 1998 Microchip Technology Inc. PIC12C5XX INDEX A ALU ....................................................................................... 9 Applications........................................................................... 4 Architectural Overview .......................................................... 9 Assembler MPASM Assembler..................................................... 53 B Block Diagram On-Chip Reset Circuit ................................................. 33 Timer0......................................................................... 23 TMR0/WDT Prescaler................................................. 26 Watchdog Timer.......................................................... 35 Brown-Out Protection Circuit .............................................. 36 O OPTION Register ............................................................... 17 OSC selection..................................................................... 27 OSCCAL Register .............................................................. 18 Oscillator Configurations .................................................... 28 Oscillator Types HS............................................................................... 28 LP ............................................................................... 28 RC .............................................................................. 28 XT ............................................................................... 28 P CAL0 bit .............................................................................. 18 CAL1 bit .............................................................................. 18 CAL2 bit .............................................................................. 18 CAL3 bit .............................................................................. 18 CALFST bit ......................................................................... 18 CALSLW bit ........................................................................ 18 Carry ..................................................................................... 9 Clocking Scheme ................................................................ 12 Code Protection ............................................................ 27, 37 Configuration Bits................................................................ 27 Configuration Word ............................................................. 27 Package Marking Information ............................................. 95 Packaging Information ........................................................ 95 PICDEM-1 Low-Cost PICmicro Demo Board ..................... 52 PICDEM-2 Low-Cost PIC16CXX Demo Board................... 52 PICDEM-3 Low-Cost PIC16CXXX Demo Board ................ 52 PICSTART Plus Entry Level Development System......... 51 POR Device Reset Timer (DRT) ................................... 27, 34 PD............................................................................... 36 Power-On Reset (POR).............................................. 27 TO............................................................................... 36 PORTA ............................................................................... 21 Power-Down Mode ............................................................. 37 Prescaler ............................................................................ 26 PRO MATE II Universal Programmer .............................. 51 Program Counter ................................................................ 19 D Q DC and AC Characteristics ........................................... 73, 91 Development Support ......................................................... 51 Development Tools ............................................................. 51 Device Varieties .................................................................... 7 Digit Carry ............................................................................. 9 Q cycles .............................................................................. 12 C E Errata .................................................................................... 3 F Family of Devices.................................................................. 5 Features................................................................................ 1 FSR..................................................................................... 20 Fuzzy Logic Dev. System (fuzzyTECH-MP) .................... 53 I I/O Interfacing ..................................................................... 21 I/O Ports.............................................................................. 21 I/O Programming Considerations........................................ 22 ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............ 51 ID Locations .................................................................. 27, 37 INDF.................................................................................... 20 Indirect Data Addressing..................................................... 20 Instruction Cycle ................................................................. 12 Instruction Flow/Pipelining .................................................. 12 Instruction Set Summary..................................................... 40 K KeeLoq Evaluation and Programming Tools.................... 54 L Loading of PC ..................................................................... 19 M Memory Organization.......................................................... 13 Data Memory .............................................................. 14 Program Memory ........................................................ 13 MPLAB Integrated Development Environment Software .... 53 R RC Oscillator ...................................................................... 29 Read Modify Write .............................................................. 22 Register File Map ............................................................... 14 Registers Special Function ......................................................... 15 Reset .................................................................................. 27 Reset on Brown-Out ........................................................... 36 S SEEVAL Evaluation and Programming System .............. 53 SLEEP .......................................................................... 27, 37 Software Simulator (MPLAB-SIM) ...................................... 53 Special Features of the CPU .............................................. 27 Special Function Registers ................................................. 15 Stack................................................................................... 19 STATUS ................................................................................9 STATUS Register ............................................................... 16 T Timer0 Switching Prescaler Assignment ................................ 26 Timer0 ........................................................................ 23 Timer0 (TMR0) Module .............................................. 23 TMR0 with External Clock .......................................... 25 Timing Diagrams and Specifications ............................ 66, 86 Timing Parameter Symbology and Load Conditions .... 65, 85 TRIS Registers ................................................................... 21 W Wake-up from SLEEP ........................................................ 37 Watchdog Timer (WDT)................................................ 27, 34 Period ......................................................................... 35 Programming Considerations ..................................... 35 WWW, On-Line Support ........................................................3 Z Zero bit ..................................................................................9 1998 Microchip Technology Inc. DS40139D-page 101 PIC12C5XX NOTES: DS40139D-page 102 1998 Microchip Technology Inc. PIC12C5XX ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-602-786-7302 for the rest of the world. 980106 The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.futureone.com/pub/microchip The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 1998 Microchip Technology Inc. Trademarks: The Microchip name, logo, PIC, PICSTART, PICMASTER and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. PICmicro, FlexROM, MPLAB and fuzzyLAB are trademarks and SQTP is a service mark of Microchip in the U.S.A. All other trademarks mentioned herein are the property of their respective companies. DS40139D-page 103 PIC12C5XX READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: Technical Publications Manager RE: Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC12C5XX Y N Literature Number: DS40139D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS40139D-page 104 1998 Microchip Technology Inc. PIC12C5XX PIC12C5XX Product Identification System Examples PART NO. -XX X /XX XXX Pattern: Special Requirements Package: SN SM P JW I E 04 Temperature Range: Frequency Range: Device = = = = = = = = a) 150 mil SOIC 208 mil SOIC 300 mil PDIP 300 mil Windowed Ceramic Side Brazed b) 0C to +70C -40C to +85C -40C to +125C c) 4 MHz PIC12C508A-04/P Commercial Temp., PDIP Package, 4 MHz, normal VDD limits PIC12C508A-04I/SM Industrial Temp., SOIC package, 4 MHz, normal VDD limits PIC12C509-04I/P Industrial Temp., PDIP package, 4 MHz, normal VDD limits PIC12C508 PIC12C509 PIC12C508T (Tape & reel for SOIC only) PIC12C509T (Tape & reel for SOIC only) PIC12C508A PIC12C509A PIC12C508AT (Tape & reel for SOIC only) PIC12C509AT (Tape & reel for SOIC only) PIC12LC508A PIC12LC509A PIC12LC508AT (Tape & reel for SOIC only) PIC12LC509AT (Tape & reel for SOIC only) Please contact your local sales office for exact ordering procedures. Sales and Support Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office (see below) 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302. 1998 Microchip Technology Inc. Preliminary DS40139D-page 105 PIC12C5XX NOTES: DS40139D-page 106 Preliminary 1998 Microchip Technology Inc. PIC12C5XX NOTES: 1998 Microchip Technology Inc. Preliminary DS40139D-page 107 M WORLDWIDE SALES AND SERVICE AMERICAS AMERICAS (continued) ASIA/PACIFIC (continued) Corporate Office Toronto Singapore Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253 Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850 Atlanta Hong Kong Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431 Boston Microchip Technology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575 Chicago Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas Microchip Technology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 972-991-7177 Fax: 972-991-8588 Dayton Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175 Detroit Microchip Technology Inc. 42705 Grand River, Suite 201 Novi, MI 48375-1727 Tel: 248-374-1888 Fax: 248-374-2874 Los Angeles ASIA/PACIFIC Taiwan, R.O.C Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE India United Kingdom Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062 Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-1189-21-5858 Fax: 44-1189-21-5835 Japan Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 France Korea Germany Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934 Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Muchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Shanghai Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-39-689 9939 Fax: 39-39-6899883 Microchip Technology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan'an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060 Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 714-263-1888 Fax: 714-263-1338 New York Microchip Technology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 All rights reserved. (c) 1998, Microchip Technology Incorporated, USA. 9/98 Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Italy 7/7/98 Microchip received ISO 9001 Quality System certification for its worldwide headquarters, design, and wafer fabrication facilities in January, 1997. Our field-programmable PICmicroTM 8-bit MCUs, Serial EEPROMs, related specialty memory products and development systems conform to the stringent quality standards of the International Standard Organization (ISO). Printed on recycled paper. Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. DS40139D-page 108 1998 Microchip Technology Inc.